Ultra Tera Corporation

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating window ball grid array semiconductor package
- Patent number 7,122,407
- Issue date Oct 17, 2006
- Ultra Tera Corporation
- Sung-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package free of chip carrier
- Patent number 6,897,566
- Issue date May 24, 2005
- Ultra Tera Corporation
- Huan-Ping Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensitive semiconductor package and fabrication method thereof
- Patent number 6,849,915
- Issue date Feb 1, 2005
- Ultra Tera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for circuit board
- Patent number 6,740,540
- Issue date May 25, 2004
- Ultra Tera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile stacked multi-chip semiconductor package with chip carr...
- Patent number 6,713,857
- Issue date Mar 30, 2004
- Ultra Tera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
Mold structure for package fabrication
- Publication number 20030235636
- Publication date Dec 25, 2003
- Ultra Tera Corporation
- Chung-Che Tsai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL