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Unaxis International Trading Ltd.
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Cham, CH
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Patents Grants
last 30 patents
Information
Patent Grant
Method for operating a pneumatic device for the metered delivery of...
Patent number
8,590,739
Issue date
Nov 26, 2013
Unaxis International Trading Ltd
Ladislav Kucera
G01 - MEASURING TESTING
Information
Patent Grant
Method for detaching a semiconductor chip from a foil and device fo...
Patent number
7,719,125
Issue date
May 18, 2010
Unaxis International Trading Ltd
Jonathan Medding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for mounting semiconductor chips
Patent number
7,415,759
Issue date
Aug 26, 2008
Unaxis International Trading Ltd
Dieter Vischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clamping device and transport mechanism for transporting substrates
Patent number
7,396,005
Issue date
Jul 8, 2008
Unaxis International Trading Ltd
Jean-Baptiste Berset
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonder
Patent number
7,353,976
Issue date
Apr 8, 2008
Unaxis International Trading Ltd
Martin Melzer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for mounting semiconductor chips
Patent number
7,287,317
Issue date
Oct 30, 2007
Unaxis International Trading Ltd
Beat Bolli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for detaching a semiconductor chip from a foil and device fo...
Patent number
7,238,593
Issue date
Jul 3, 2007
Unaxis International Trading Ltd
Jonathan Medding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for mounting or wiring semiconductor chips
Patent number
7,193,727
Issue date
Mar 20, 2007
Unaxis International Trading Ltd
Patrick Blessing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for calibrating a bondhead
Patent number
7,184,909
Issue date
Feb 27, 2007
Unaxis International Trading Ltd
Daniel Bolliger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonder with a downholder for pressing the fingers of a system...
Patent number
7,134,589
Issue date
Nov 14, 2006
Unaxis International Trading Ltd
Stéphane Balon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for aligning the bondhead of a Die Bonder
Patent number
7,066,373
Issue date
Jun 27, 2006
Unaxis International Trading Ltd
Stefan Behler
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patents Applications
last 30 patents
Information
Patent Application
Method And Apparatus For Mounting Semiconductor Chips
Publication number
20080301931
Publication date
Dec 11, 2008
Unaxis International Trading Ltd.
Dieter Vischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for detaching a semiconductor chip from a foil and device fo...
Publication number
20070228539
Publication date
Oct 4, 2007
Unaxis International Trading Ltd., a Swiss Corporation
Jonathan Medding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for mounting a flip chip on a substrate
Publication number
20070145102
Publication date
Jun 28, 2007
Unaxis International Trading Ltd.
Patrick Blessing
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Device for applying adhesive to a substrate
Publication number
20070017638
Publication date
Jan 25, 2007
Unaxis International Trading Ltd. a Swiss Corporation
Andre Moebius
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for operating a pneumatic device for the metered delivery of...
Publication number
20060225786
Publication date
Oct 12, 2006
Unaxis International Trading Ltd
Ladislav Kucera
G01 - MEASURING TESTING
Information
Patent Application
Method for producing a wire connection
Publication number
20060213956
Publication date
Sep 28, 2006
Unaxis International Trading Ltd.
Shui Yuan Yu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for mounting a semiconductor chip onto a substrate
Publication number
20060118602
Publication date
Jun 8, 2006
Unaxis International Trading Ltd
Matthias Urben
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire bonder
Publication number
20060076390
Publication date
Apr 13, 2006
Unaxis International Trading Ltd
Martin Melzer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Clamping device and transport mechanism for transporting substrates
Publication number
20060071385
Publication date
Apr 6, 2006
Unaxis International Trading Ltd
Jean-Baptiste Berset
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
Apparatus and method for applying adhesive to a substrate
Publication number
20060003096
Publication date
Jan 5, 2006
Unaxis International Trading Ltd
Dominik Hartmann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and apparatus for mounting semiconductor chips
Publication number
20060000082
Publication date
Jan 5, 2006
Unaxis International Trading Ltd
Dieter Vischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for detaching a semiconductor chip from a foil and apparatus...
Publication number
20050224965
Publication date
Oct 13, 2005
Unaxis International Trading Ltd
Jonathan Medding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
Publication number
20050167473
Publication date
Aug 4, 2005
Unaxis International Trading Ltd.
Michael Mayer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire bonder with a downholder for pressing the fingers of a system...
Publication number
20050067462
Publication date
Mar 31, 2005
Unaxis International Trading Ltd.
Stephane Balon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR