Unimicron Taiwan Corp.

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating inter-layer solid conductive rods
- Patent number 6,749,737
- Issue date Jun 15, 2004
- Unimicron Taiwan Corp.
- Jao-Chin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole metal-filling method
- Patent number 6,638,858
- Issue date Oct 28, 2003
- Unimicron Taiwan Corp.
- David C. H. Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making mechanical-laser structure
- Patent number 6,353,999
- Issue date Mar 12, 2002
- Unimicron Taiwan Corp.
- David C. H. Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a solder resist mask
- Patent number 6,210,746
- Issue date Apr 3, 2001
- Unimicron Taiwan Corp.
- David C. H. Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

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