United Test & Assembly Center Ltd.

Organization

Singapore, SG

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,403,592
- Issue date Sep 3, 2019
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,786,625
- Issue date Oct 10, 2017
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,281,218
- Issue date Mar 8, 2016
- United Test & Assembly Center Ltd.
- Danny Retuta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,165,878
- Issue date Oct 20, 2015
- United Test & Assembly Center Ltd.
- Yong Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structural member
- Patent number 9,142,487
- Issue date Sep 22, 2015
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,136,142
- Issue date Sep 15, 2015
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,117,808
- Issue date Aug 25, 2015
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,087,777
- Issue date Jul 21, 2015
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe area array packaging technology
- Patent number 9,023,690
- Issue date May 5, 2015
- United Test and Assembly Center
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,916,422
- Issue date Dec 23, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,860,079
- Issue date Oct 14, 2014
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,829,666
- Issue date Sep 9, 2014
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip leadframe semiconductor package
- Patent number 8,816,482
- Issue date Aug 26, 2014
- United Test & Assembly Center Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for semiconductor package
- Patent number 8,772,921
- Issue date Jul 8, 2014
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through silicon via dies and packages
- Patent number 8,741,762
- Issue date Jun 3, 2014
- United Test & Assembly Center Ltd.
- Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,716,873
- Issue date May 6, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,703,534
- Issue date Apr 22, 2014
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of packaging semiconductor devices
- Patent number 8,647,924
- Issue date Feb 11, 2014
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of attaching semiconductor dies to...
- Patent number 8,592,258
- Issue date Nov 26, 2013
- United Test and Assembly Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via dies and packages
- Patent number 8,586,465
- Issue date Nov 19, 2013
- United Test & Assembly Center Ltd.
- Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subscriber identity module (SIM) card
- Patent number 8,544,755
- Issue date Oct 1, 2013
- United Test & Assembly Center Ltd.
- Rahamat Bidin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vented die and package
- Patent number 8,426,246
- Issue date Apr 23, 2013
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold design and semiconductor package
- Patent number 8,399,985
- Issue date Mar 19, 2013
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structural member
- Patent number 8,384,203
- Issue date Feb 26, 2013
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die stack package
- Patent number 8,288,862
- Issue date Oct 16, 2012
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented die and package
- Patent number 8,143,719
- Issue date Mar 27, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip scale leadframe package and method of manufacturi...
- Patent number 8,129,222
- Issue date Mar 6, 2012
- United Test and Assembly Test Center Ltd.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for semiconductor package
- Patent number 8,115,292
- Issue date Feb 14, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor package and method of producing th...
- Patent number 8,039,951
- Issue date Oct 18, 2011
- United Test & Assembly Center Ltd.
- Kolan Ravi Kanth
- H01 - BASIC ELECTRIC ELEMENTS

Please log in for detailed analytics

Patents Applicationslast 30 patents

Information Patent Application
RELIABLE INTERCONNECT
- Publication number 20160233179
- Publication date Aug 11, 2016
- United Test & Assembly Center Ltd.
- Rui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE
- Publication number 20160211196
- Publication date Jul 21, 2016
- United Test & Assembly Center Ltd.
- Danny RETUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
- Publication number 20150214187
- Publication date Jul 30, 2015
- United Test and Assembly Center, Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20150102478
- Publication date Apr 16, 2015
- United Test & Assembly Center Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150084197
- Publication date Mar 26, 2015
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150061101
- Publication date Mar 5, 2015
- United Test & Assembly Center Ltd.
- Kriangsak Sae LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264789
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264792
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Yong Bo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264835
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140227832
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140225242
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
- Publication number 20140138808
- Publication date May 22, 2014
- United Test & Assembly Center Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DIES AND PACKAGES
- Publication number 20140045301
- Publication date Feb 13, 2014
- United Test & Assembly Center Ltd.
- Hao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURAL MEMBER
- Publication number 20130119560
- Publication date May 16, 2013
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120220082
- Publication date Aug 30, 2012
- United Test and Assembly Center, Ltd.
- Catherine Bee Liang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120193812
- Publication date Aug 2, 2012
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED DIE AND PACKAGE
- Publication number 20120149150
- Publication date Jun 14, 2012
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120119378
- Publication date May 17, 2012
- United Test & Assembly Center Ltd.
- Catherine Bee Liang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
- Publication number 20120104628
- Publication date May 3, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20120034738
- Publication date Feb 9, 2012
- QIMONDA AG
- Denver Paul C. CASTILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
- Publication number 20120018869
- Publication date Jan 26, 2012
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120001306
- Publication date Jan 5, 2012
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSCRIBER IDENTITY MODULE (SIM) CARD
- Publication number 20110315779
- Publication date Dec 29, 2011
- United Test & Assembly Center Ltd.
- Rahamat Bidin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20100261313
- Publication date Oct 14, 2010
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
- Publication number 20100109142
- Publication date May 6, 2010
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20100109169
- Publication date May 6, 2010
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHRINK PACKAGE ON BOARD
- Publication number 20100102436
- Publication date Apr 29, 2010
- United Test & Assembly Center Ltd.
- Kian Teng ENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURAL MEMBER
- Publication number 20100013081
- Publication date Jan 21, 2010
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVEN CONTROL SYSTEM
- Publication number 20090266807
- Publication date Oct 29, 2009
- United Test and Assembly Test Center Ltd.
- Venkatachalam VALLIAPPAN
- H01 - BASIC ELECTRIC ELEMENTS

Please log in for detailed analytics

Trademarklast 30 trademarks

Information Trademark
85123453 - ISO-ETCH
- Serial number 85123453
- Filing date Sep 5, 2010
- United Test and Assembly Center Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
85123457 - ISO-ETCH
- Serial number 85123457
- Filing date Sep 5, 2010
- United Test and Assembly Center Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76466455 - UTAC
- Serial number 76466455
- Registration number 2932323
- Filing date Nov 13, 2002
- UNITED TEST AND ASSEMBLY CENTER LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76430869 - UTAC
- Serial number 76430869
- Registration number 2857300
- Filing date Jul 15, 2002
- UNITED TEST AND ASSEMBLY CENTER LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

United Test & Assembly Center Ltd.

Organization

Patents Grantslast 30 patents

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Method of producing a semiconductor package

Semiconductor packages and methods of packaging semiconductor devices

Packaging structural member

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Leadframe area array packaging technology

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Flip-chip leadframe semiconductor package

Interposer for semiconductor package

Through silicon via dies and packages

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor package and method of packaging semiconductor devices

Semiconductor package and method of attaching semiconductor dies to...

Through silicon via dies and packages

Subscriber identity module (SIM) card

Vented die and package

Mold design and semiconductor package

Packaging structural member

Multiple die stack package

Copper on organic solderability preservative (OSP) interconnect and...

Vented die and package

High density chip scale leadframe package and method of manufacturi...

Interposer for semiconductor package

Thermally enhanced semiconductor package and method of producing th...

Patents Applicationslast 30 patents

RELIABLE INTERCONNECT

METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE

LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

THROUGH SILICON VIA DIES AND PACKAGES

PACKAGING STRUCTURAL MEMBER

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

VENTED DIE AND PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

INTERPOSER FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

MOLD DESIGN AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SUBSCRIBER IDENTITY MODULE (SIM) CARD

SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES

INTERPOSER FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SHRINK PACKAGE ON BOARD

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...

PACKAGING STRUCTURAL MEMBER

OVEN CONTROL SYSTEM

Trademarklast 30 trademarks

85123453 - ISO-ETCH

85123457 - ISO-ETCH

76466455 - UTAC

76430869 - UTAC