United Test Center Inc.

Organization

Hsin Chu, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,951,644
- Issue date May 31, 2011
- United Test Center Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,790,712
- Issue date Sep 14, 2004
- United Test Center, Inc.
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile optically-sensitive semiconductor package
- Patent number 6,683,386
- Issue date Jan 27, 2004
- United Test Center, Inc.
- Jinchuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,459,163
- Issue date Oct 1, 2002
- United Test Center, Inc.
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile semiconductor package and process for making the same
- Patent number 6,326,700
- Issue date Dec 4, 2001
- United Test Center, Inc.
- Jinchuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale packaging method
- Patent number 6,190,943
- Issue date Feb 20, 2001
- United Test Center Inc.
- Cheng-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD
- Publication number 20100163605
- Publication date Jul 1, 2010
- United Test Center Inc.
- Shiann-Tsong Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100148361
- Publication date Jun 17, 2010
- United Test Center Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory card and method for fabricating the same
- Publication number 20080273299
- Publication date Nov 6, 2008
- United Test Center Inc.
- Ming-Sung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20040266067
- Publication date Dec 30, 2004
- United Test Center, Inc.
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY
- Publication number 20040041249
- Publication date Mar 4, 2004
- United Test Center Inc.
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-sided thermally enhanced IC chip package
- Publication number 20040042140
- Publication date Mar 4, 2004
- United Test Center Inc.
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pads of printed circuit board capable of holding solder bal...
- Publication number 20040020688
- Publication date Feb 5, 2004
- United Test Center Inc.
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging process for semiconductor package
- Publication number 20020187591
- Publication date Dec 12, 2002
- UNITED TEST CENTER, INC
- Jin Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile optically-sensitive semiconductor package
- Publication number 20020047200
- Publication date Apr 25, 2002
- UNITED TEST CENTER, INC
- Jinchuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device without use of chip carrier and method for mak...
- Publication number 20020041039
- Publication date Apr 11, 2002
- UNITED TEST CENTER, INC
- Jin Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
75787063 - WINDOWBGA
- Serial number 75787063
- Registration number 2928451
- Filing date Aug 27, 1999
- UNITED TEST CENTER INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

United Test Center Inc.

Organization

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Low profile optically-sensitive semiconductor package

Semiconductor device and method for fabricating the same

Low profile semiconductor package and process for making the same

Chip scale packaging method

Patents Applicationslast 30 patents

BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Memory card and method for fabricating the same

Semiconductor device and method for fabricating the same

STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY

Double-sided thermally enhanced IC chip package

Bonding pads of printed circuit board capable of holding solder bal...

Packaging process for semiconductor package

Low profile optically-sensitive semiconductor package

Semiconductor device without use of chip carrier and method for mak...

Trademarklast 30 trademarks

75787063 - WINDOWBGA