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Patents Grants
last 30 patents
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Patent Grant
Multi-chip ball grid array package and method of manufacture
Patent number
7,851,899
Issue date
Dec 14, 2010
UTAC - United Test and Assembly Test Center Ltd.
Fung Leng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package and method of manufacture
Patent number
7,678,610
Issue date
Mar 16, 2010
UTAC - United Test and Assembly Test Center Ltd.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded high density electronic packaging structure for high perform...
Patent number
7,361,995
Issue date
Apr 22, 2008
Xilinx, Inc.
Kim Yong Goh
H01 - BASIC ELECTRIC ELEMENTS
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Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
Publication number
20090194871
Publication date
Aug 6, 2009
UTAC - United Test and Assembly Test Center, Ltd.
Denver Paul C. Castillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
Publication number
20080251938
Publication date
Oct 16, 2008
UTAC - United Test and Assembly Center LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High performance chip scale leadframe with t-shape die pad and meth...
Publication number
20060202313
Publication date
Sep 14, 2006
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip package and method of manufacture
Publication number
20060192292
Publication date
Aug 31, 2006
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High density chip scale leadframe package and method of manufacturi...
Publication number
20050275077
Publication date
Dec 15, 2005
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS