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Dongguan City, CN
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Patents Grants
last 30 patents
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Patent Grant
Thermal leadless array package with die attach pad locking feature
Patent number
9,196,504
Issue date
Nov 24, 2015
UTAC DONGGUAN LTD.
Albert Loh
H01 - BASIC ELECTRIC ELEMENTS
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Patents Applications
last 30 patents
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Patent Application
THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE
Publication number
20140008777
Publication date
Jan 9, 2014
UTAC DONGGUAN LTD
Albert LOH
H01 - BASIC ELECTRIC ELEMENTS