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Patents Grantslast 30 patents

Information Patent Grant
Reliable semiconductor packages
- Patent number 12,100,719
- Issue date Sep 24, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,021,096
- Issue date Jun 25, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Dennis Fernandez Tresnado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of cleaning and inspecting semiconductor die carrier
- Patent number 11,945,004
- Issue date Apr 2, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- B08 - CLEANING
Information Patent Grant
Semiconductor packages with integrated shielding
- Patent number 11,901,308
- Issue date Feb 13, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dams
- Patent number 11,881,494
- Issue date Jan 23, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective layer around...
- Patent number 11,804,416
- Issue date Oct 31, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic semiconductor packages
- Patent number 11,784,102
- Issue date Oct 10, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Eakkasit Dumsong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,661
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Enrique Jr Sarile
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,681
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages without debris
- Patent number 11,670,549
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages for sensor chips
- Patent number 11,670,521
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies electrically connected to a package substrate by lead...
- Patent number 11,227,818
- Issue date Jan 18, 2022
- UTAC HEADQUARTERS PTE. LTD.
- Wing Keung Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 11,177,301
- Issue date Nov 16, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bonding layer with spacers between a package substrate a...
- Patent number 11,145,575
- Issue date Oct 12, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple molding routing layers and a me...
- Patent number 10,734,247
- Issue date Aug 4, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with electromagnetic interference shielding
- Patent number 10,714,431
- Issue date Jul 14, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 10,707,161
- Issue date Jul 7, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a heat spreader and method of manufactur...
- Patent number 10,658,277
- Issue date May 19, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plated metal shielding and a method thereof
- Patent number 10,600,741
- Issue date Mar 24, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Suebphong Yenrudee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive shield for semiconductor package
- Patent number 10,586,771
- Issue date Mar 10, 2020
- UTAC HEADQUARTERS PTE, LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer leadless semiconductor package and method of manufactur...
- Patent number 10,573,590
- Issue date Feb 25, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with processor package
- Patent number 10,566,369
- Issue date Feb 18, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Tim Thian Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with partial plating on contact side surfaces
- Patent number 10,515,878
- Issue date Dec 24, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 10,381,280
- Issue date Aug 13, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with multiple stacked leadframes and a method...
- Patent number 10,361,146
- Issue date Jul 23, 2019
- UTAC HEADQUARTERS PTE, LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,354,934
- Issue date Jul 16, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple molding routing layers and a me...
- Patent number 10,325,782
- Issue date Jun 18, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple stacked leadframes and a method...
- Patent number 10,276,477
- Issue date Apr 30, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20240339484
- Publication date Oct 10, 2024
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240234195
- Publication date Jul 11, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS
- Publication number 20240186346
- Publication date Jun 6, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240136217
- Publication date Apr 25, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230377896
- Publication date Nov 23, 2023
- UTAC Headquarters Pte. Ltd.
- Jackson Fernandez Rosario
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230274979
- Publication date Aug 31, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230178413
- Publication date Jun 8, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd SHARIFF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING
- Publication number 20230154795
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230154796
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS
- Publication number 20230122384
- Publication date Apr 20, 2023
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS
- Publication number 20230098224
- Publication date Mar 30, 2023
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Cleaning and Inspecting Semiconductor Die Carrier
- Publication number 20230058682
- Publication date Feb 23, 2023
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- B08 - CLEANING
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20230036239
- Publication date Feb 2, 2023
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illuminator Method and Device for Semiconductor Package Testing
- Publication number 20220390510
- Publication date Dec 8, 2022
- UTAC Headquarters Pte. Ltd.
- Boon Chew Goh
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Forming an Optical Semiconductor...
- Publication number 20220384505
- Publication date Dec 1, 2022
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERE...
- Publication number 20220336283
- Publication date Oct 20, 2022
- UTAC Headquarters Pte. Ltd.
- Enrique Jr Sarile
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS
- Publication number 20220331917
- Publication date Oct 20, 2022
- UTAC Headquarters Pte. Ltd.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Disposing Electrical Components...
- Publication number 20220320033
- Publication date Oct 6, 2022
- UTAC Headquarters Pte. Ltd.
- Krit Pajuvang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE...
- Publication number 20220270942
- Publication date Aug 25, 2022
- UTAC Headquarters Pte. Ltd.
- Nataporn Charusabha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Clip Bond Having Multipl...
- Publication number 20220208716
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Hyung Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH VERTICAL PASSIVE COMPONENTS
- Publication number 20220208746
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DAMS
- Publication number 20220093482
- Publication date Mar 24, 2022
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20220093664
- Publication date Mar 24, 2022
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Layer Around...
- Publication number 20220077019
- Publication date Mar 10, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
79217820 - GQFN
- Serial number 79217820
- Registration number 5603653
- Filing date Aug 14, 2015
- UTAC Headquarters Pte. Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

UTAC Headquarters Pte. Ltd.

Organization

Patents Grantslast 30 patents

Reliable semiconductor packages

Reliable semiconductor packages

System and method of cleaning and inspecting semiconductor die carrier

Semiconductor packages with integrated shielding

Semiconductor package with dams

Semiconductor device and method of forming protective layer around...

Hermetic semiconductor packages

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Clip bond semiconductor packages and assembly tools

Semiconductor packages without debris

Reliable semiconductor packages for sensor chips

Stacked dies electrically connected to a package substrate by lead...

Reliable semiconductor packages

Conductive bonding layer with spacers between a package substrate a...

Cavity wall structure for semiconductor packaging

Semiconductor package with multiple molding routing layers and a me...

Semiconductor packages with electromagnetic interference shielding

Cavity wall structure for semiconductor packaging

Semiconductor package with a heat spreader and method of manufactur...

Semiconductor package with plated metal shielding and a method thereof

Conductive shield for semiconductor package

Multi-layer leadless semiconductor package and method of manufactur...

Image sensor with processor package

Semiconductor package with partial plating on contact side surfaces

Semiconductor packages and methods for forming semiconductor package

Semiconductor package with multiple stacked leadframes and a method...

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor package with multiple molding routing layers and a me...

Semiconductor package with multiple stacked leadframes and a method...

Patents Applicationslast 30 patents

RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Making an Optical Semiconductor...

Semiconductor Device and Method of Making a Substrate with Improved...

SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS

Semiconductor Device and Method of Making a Substrate with Improved...

Semiconductor Device Carriers and Methods of Making and Using

Semiconductor Device and Method for Sensing External Condition in H...

BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF

Semiconductor Packages and Methods of Forming RDL and Side and Back...

PLASMA DICED WAFERS AND METHODS THEREOF

Semiconductor Device and Method of Making a MEMS Semiconductor Package

PLASMA DICED WAFERS AND METHODS THEREOF

FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING

PLASMA DICED WAFERS AND METHODS THEREOF

SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

System and Method of Cleaning and Inspecting Semiconductor Die Carrier

Semiconductor Device and Method of Making an Optical Semiconductor...

Illuminator Method and Device for Semiconductor Package Testing

Semiconductor Device and Method of Forming an Optical Semiconductor...

WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERE...

WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS

Semiconductor Device and Method of Disposing Electrical Components...

FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE...

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

SEMICONDUCTOR PACKAGES WITH VERTICAL PASSIVE COMPONENTS

SEMICONDUCTOR PACKAGE WITH DAMS

RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Forming Protective Layer Around...

Trademarklast 30 trademarks

79217820 - GQFN