VIASYSTEMS TECHNOLOGIES CORP., L.L.C

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ST. LOUIS, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for anchoring a conductive cap on a filled via in a printed...
- Patent number 9,913,382
- Issue date Mar 6, 2018
- Viasystems Technologies Corp. L.L.C.
- Rajwant Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods of manufacturing printed circuit boards using b...
- Patent number 9,736,948
- Issue date Aug 15, 2017
- Viasystems Technologies Corp., L.L.C.
- Rajesh Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed circuit boards with stacked micro...
- Patent number 9,485,876
- Issue date Nov 1, 2016
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for reducing overhang on electroplated surfaces...
- Patent number 9,017,540
- Issue date Apr 28, 2015
- Viasystems Technologies Corp. L.L.C.
- Rajwant S. Sidhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board with embedded heater
- Patent number 9,012,811
- Issue date Apr 21, 2015
- Viasystems Technologies Corp. L.L.C.
- Gil White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed circuit boards with stacked micro...
- Patent number 8,950,063
- Issue date Feb 10, 2015
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed circuit boards using parallel proc...
- Patent number 8,863,379
- Issue date Oct 21, 2014
- Viasystems Technologies Corp., L.L.C.
- Rajesh Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED...
- Publication number 20160316563
- Publication date Oct 27, 2016
- Viasystems Technologies Corp., L.L.C.
- Rajwant Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO...
- Publication number 20150041428
- Publication date Feb 12, 2015
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

VIASYSTEMS TECHNOLOGIES CORP., L.L.C

Organization

Patents Grantslast 30 patents

Method for anchoring a conductive cap on a filled via in a printed...

Systems and methods of manufacturing printed circuit boards using b...

Methods of manufacturing printed circuit boards with stacked micro...

Systems and methods for reducing overhang on electroplated surfaces...

Printed circuit board with embedded heater

Methods of manufacturing printed circuit boards with stacked micro...

Methods of manufacturing printed circuit boards using parallel proc...

Patents Applicationslast 30 patents

METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED...

METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO...

Trademarklast 30 trademarks