WACKER SILTRONIC GESELLSCHFT FUR HALBLEITERMATERIALIEN AG

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D-84489 Burghausen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Wire saw and method for cutting wafers from a workpiece
- Patent number 5,616,065
- Issue date Apr 1, 1997
- Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft
- Karl Egglhuber
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
75189463 - POWERFZ
- Serial number 75189463
- Registration number 2177880
- Filing date Oct 29, 1996
- WACKER SILTRONIC GESELLSCHFT FUR HALBLEITERMATERIALIEN AG
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry