Waffer Technology Corp.

Organization

Taoyuan Hsien, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Internally disposed cooling device for electronic apparatus
- Patent number 7,190,576
- Issue date Mar 13, 2007
- Waffer Technology Corp.
- Jack Wang
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Water-cooling heat dissipation system
- Patent number 7,069,737
- Issue date Jul 4, 2006
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device having improved fastening structure
- Patent number 7,019,979
- Issue date Mar 28, 2006
- Waffer Technology Corp.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening structure of heat sink
- Patent number 6,968,889
- Issue date Nov 29, 2005
- Waffer Technology Corp.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nail cartridge structure for nail gun
- Patent number 6,729,523
- Issue date May 4, 2004
- Waffer Technology Corp.
- Jack Wang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Positioning and buckling structure for use in a radiator
- Patent number 6,672,379
- Issue date Jan 6, 2004
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Positioning structure for heat dissipating fins
- Patent number 6,607,028
- Issue date Aug 19, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink assembly
- Patent number 6,595,275
- Issue date Jul 22, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating fin
- Patent number 6,571,862
- Issue date Jun 3, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device for a CPU
- Patent number 6,542,370
- Issue date Apr 1, 2003
- Waffer Technology Corporation
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipater for a central processing unit
- Patent number 6,477,045
- Issue date Nov 5, 2002
- Waffer Technology Corp.
- Tien-Lai Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fastening device for heat slug
- Publication number 20040130875
- Publication date Jul 8, 2004
- WAFFER TECHNOLOGY CORP.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
77021030 - WAFFER
- Serial number 77021030
- Registration number 3364307
- Filing date Oct 13, 2006
- Waffer Technology Corp.
- 6 - Common metals and their alloys

Waffer Technology Corp.

Organization

Patents Grantslast 30 patents

Internally disposed cooling device for electronic apparatus

Water-cooling heat dissipation system

Heat dissipating device having improved fastening structure

Fastening structure of heat sink

Nail cartridge structure for nail gun

Positioning and buckling structure for use in a radiator

Positioning structure for heat dissipating fins

Heat sink assembly

Heat dissipating fin

Heat dissipating device for a CPU

Heat dissipater for a central processing unit

Patents Applicationslast 30 patents

Fastening device for heat slug

Trademarklast 30 trademarks

77021030 - WAFFER