WALSIN ADVANCED ELECTRONICS LTD

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K.E.P.Z, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package having array of metal pegs linked by printed circuit lines
- Patent number 6,762,118
- Issue date Jul 13, 2004
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro BGA package
- Patent number 6,650,005
- Issue date Nov 18, 2003
- Walsin Advanced Electronics LTD
- Chia-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wafer level chip size package
- Patent number 6,521,485
- Issue date Feb 18, 2003
- Walsin Advanced Electronics Ltd.
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation module for a BGA IC
- Patent number 6,486,564
- Issue date Nov 26, 2002
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN semiconductor package
- Patent number 6,459,148
- Issue date Oct 1, 2002
- Walsin Advanced Electronics LTD
- Su Chun-Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor die package
- Patent number 6,459,162
- Issue date Oct 1, 2002
- Walsin Advanced Electronics LTD
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal pads
- Patent number 6,437,429
- Issue date Aug 20, 2002
- Walsin Advanced Electronics LTD
- Chun-Jen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-board BGA package
- Patent number 6,385,049
- Issue date May 7, 2002
- Walsin Advanced Electronics LTD
- Hung Chia-Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package having metal peg leads...
- Patent number 6,380,062
- Issue date Apr 30, 2002
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure
- Patent number 6,380,624
- Issue date Apr 30, 2002
- Walsin Advanced Electronics Ltd.
- Chia-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable QFN semiconductor package
- Patent number 6,337,510
- Issue date Jan 8, 2002
- Walsin Advanced Electronics Ltd.
- Su Chun-Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame type semiconductor package
- Patent number 6,278,182
- Issue date Aug 21, 2001
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with heat slug
- Patent number 6,262,475
- Issue date Jul 17, 2001
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure
- Patent number 6,204,553
- Issue date Mar 20, 2001
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for preventing the warping of semiconductor pa...
- Patent number 6,078,099
- Issue date Jun 20, 2000
- Walsin Advanced Electronics LTD
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for making multi-chip packages and single chip packages simu...
- Publication number 20030224542
- Publication date Dec 4, 2003
- Walsin Advanced Electronics LTD
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for making a ball grid array semiconductor package
- Publication number 20030100174
- Publication date May 29, 2003
- Walsin Advanced Electronics LTD
- Jansen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package for fixed surface mounting
- Publication number 20030006055
- Publication date Jan 9, 2003
- Walsin Advanced Electronics LTD
- Lai Chien-Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TCP optical device
- Publication number 20030001250
- Publication date Jan 2, 2003
- Walsin Advanced Electronics LTD
- Lai Chien-Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro BGA package
- Publication number 20020190366
- Publication date Dec 19, 2002
- Walsin Advanced Electronics LTD
- Chia-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding inner leads of leadframe to substrate
- Publication number 20020182773
- Publication date Dec 5, 2002
- Walsin Advanced Electronics LTD
- Chun-Jen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for underfilling bonding gap between flip-chip and circuit s...
- Publication number 20020173074
- Publication date Nov 21, 2002
- Walsin Advanced Electronics LTD
- Su Chun-Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME
- Publication number 20020140113
- Publication date Oct 3, 2002
- Walsin Advanced Electronics LTD
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing wafer level chip size package
- Publication number 20020094601
- Publication date Jul 18, 2002
- Walsin Advanced Electronics LTD
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing chip size package and its structure
- Publication number 20020094683
- Publication date Jul 18, 2002
- Walsin Advanced Electronics LTD
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS

WALSIN ADVANCED ELECTRONICS LTD

Organization

Patents Grantslast 30 patents

Package having array of metal pegs linked by printed circuit lines

Micro BGA package

Method for manufacturing wafer level chip size package

Heat dissipation module for a BGA IC

QFN semiconductor package

Encapsulated semiconductor die package

Semiconductor package with metal pads

Multi-board BGA package

Method of fabricating semiconductor package having metal peg leads...

Stacked integrated circuit structure

Stackable QFN semiconductor package

Lead frame type semiconductor package

Lead frame with heat slug

Lead frame structure

Lead frame structure for preventing the warping of semiconductor pa...

Patents Applicationslast 30 patents

Method for making multi-chip packages and single chip packages simu...

Process for making a ball grid array semiconductor package

Semiconductor package for fixed surface mounting

TCP optical device

Micro BGA package

Method for bonding inner leads of leadframe to substrate

Method for underfilling bonding gap between flip-chip and circuit s...

ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME

Method for manufacturing wafer level chip size package

Method for manufacturing chip size package and its structure

Trademarklast 30 trademarks