WAVENICS INC.

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Daejeon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Terminal-integrated metal base package module and terminal-integrat...
- Patent number 8,664,538
- Issue date Mar 4, 2014
- Wavenics Inc.
- Kyoung-Min Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package module structure for high power device with metal substrate...
- Patent number 8,497,586
- Issue date Jul 30, 2013
- LUMENS CO., LTD
- Kyoung-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-based photonic device package module
- Patent number 8,120,045
- Issue date Feb 21, 2012
- Wavenics Inc.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating passive device applied to the three-dimension...
- Patent number 8,034,664
- Issue date Oct 11, 2011
- Wavenics Inc.
- Young-Se Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional package module
- Patent number 7,851,918
- Issue date Dec 14, 2010
- Wavenics Inc.
- Young-Se Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing passive device and semiconductor package u...
- Patent number 7,838,380
- Issue date Nov 23, 2010
- Wavenics Inc.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20150194585
- Publication date Jul 9, 2015
- LUMENS CO., LTD
- Kyoungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRAT...
- Publication number 20130037309
- Publication date Feb 14, 2013
- WAVENICS INC.
- Kyoung-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE STRUCTURE FOR HIGH POWER DEVICE WITH METAL SUBSTRATE...
- Publication number 20130020726
- Publication date Jan 24, 2013
- WAVENICS INC.
- Kyoung-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING METAL BASE PACKAGE WITH VIA
- Publication number 20120103475
- Publication date May 3, 2012
- WAVENICS INC.
- Kyoung-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, A...
- Publication number 20110037164
- Publication date Feb 17, 2011
- WAVENICS, INC.
- Young-Se KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH EFFICIENCY LED WITH MULTI-LAYER REFLECTOR STRUCTURE AND METHOD...
- Publication number 20110033962
- Publication date Feb 10, 2011
- WAVENICS INC.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PAC...
- Publication number 20100326707
- Publication date Dec 30, 2010
- WAVENICS INC.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD...
- Publication number 20100133557
- Publication date Jun 3, 2010
- WAVENICS INC.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20090175022
- Publication date Jul 9, 2009
- WAVENICS INC.
- Young-Se Kwon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH EFFICIENCY LED WITH MULTI-LAYER REFLECTOR STRUCTURE AND METHOD...
- Publication number 20090146168
- Publication date Jun 11, 2009
- WAVENICS INC.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, A...
- Publication number 20090032914
- Publication date Feb 5, 2009
- WAVENICS INC.
- Young-Se Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

WAVENICS INC.

Organization

Patents Grantslast 30 patents

Terminal-integrated metal base package module and terminal-integrat...

Package module structure for high power device with metal substrate...

Metal-based photonic device package module

Method of fabricating passive device applied to the three-dimension...

Three-dimensional package module

Method for manufacturing passive device and semiconductor package u...

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRAT...

PACKAGE MODULE STRUCTURE FOR HIGH POWER DEVICE WITH METAL SUBSTRATE...

METHOD OF MANUFACTURING METAL BASE PACKAGE WITH VIA

THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, A...

HIGH EFFICIENCY LED WITH MULTI-LAYER REFLECTOR STRUCTURE AND METHOD...

METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PAC...

METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD...

MULTI-LAYER PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

HIGH EFFICIENCY LED WITH MULTI-LAYER REFLECTOR STRUCTURE AND METHOD...

THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, A...

Trademarklast 30 trademarks