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MEMS CHIP
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Publication number 20230041430
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Publication date Feb 9, 2023
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Weifang Goertek Microelectronics Co., Ltd.
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GUANXUN QIU
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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PACKAGING METHOD FOR CIRCUIT UNITS
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Publication number 20220406619
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Publication date Dec 22, 2022
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WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
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Haisheng Wang
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGING STRUCTURE FOR CIRCUIT UNITS
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Publication number 20220408549
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Publication date Dec 22, 2022
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WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
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Haisheng Wang
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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MEMS CHIP AND ELECTRIC DEVICE
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Publication number 20220388836
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Publication date Dec 8, 2022
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WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
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BO Liu
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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MICRO-FILTER AND ACOUSTIC DEVICE
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Publication number 20220377442
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Publication date Nov 24, 2022
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Weifang Goertek Microelectronics Co., Ltd.
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YUJING LIN
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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METHOD FOR PACKAGING CHIP
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Publication number 20220367209
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Publication date Nov 17, 2022
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WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
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Baoguan Yin
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H01 - BASIC ELECTRIC ELEMENTS
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SHIELDING PROCESS FOR SIP PACKAGING
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Publication number 20220254731
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Publication date Aug 11, 2022
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WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
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Juncheng Guo
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H01 - BASIC ELECTRIC ELEMENTS
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