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Hsinchu City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated compact MEMS device with deep trench contacts
Patent number
8,587,077
Issue date
Nov 19, 2013
WindTop Technology Corp.
Kun-Lung Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Apparatus for converting MEMS inductive capacitance
Patent number
7,817,075
Issue date
Oct 19, 2010
WindTop Technology Corp.
Chih-Shiun Lu
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Direct capacitance-to-digital converter
Patent number
7,782,243
Issue date
Aug 24, 2010
WindTop Technology Corp.
Chih-Shiun Lu
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED MEMS MICROPHONE WITH MECHANICAL ELECTRICAL ISOLATION
Publication number
20150060955
Publication date
Mar 5, 2015
WindTop Technology Corp.
Kun-Lung Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED MEMS PRESSURE SENSOR WITH MECHANICAL ELECTRICAL ISOLATION
Publication number
20150060956
Publication date
Mar 5, 2015
WindTop Technology Corp.
Kun-Lung Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS PACKAGE
Publication number
20100109103
Publication date
May 6, 2010
Windtop Technology Corp., a Taiwan Corporation
Hung-Chang Tsao
B81 - MICRO-STRUCTURAL TECHNOLOGY
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