XINTEC, INC.

Organization

Taoyuan Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Stacked chip package and method for forming the same
- Patent number 8,963,312
- Issue date Feb 24, 2015
- Xintec, Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,951,836
- Issue date Feb 10, 2015
- Xintec, Inc.
- Yu-Lin Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,952,501
- Issue date Feb 10, 2015
- Xintec, Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,928,098
- Issue date Jan 6, 2015
- Xintec, Inc.
- Hung-Jen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IC wafer having electromagnetic shielding effects and method for ma...
- Patent number 8,624,362
- Issue date Jan 7, 2014
- Xintec, Inc.
- Yao-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for making the same
- Patent number 8,624,351
- Issue date Jan 7, 2014
- Xintec, Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and fabrication method thereof
- Patent number 8,536,672
- Issue date Sep 17, 2013
- Xintec, Inc.
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conducting layer in chip package module
- Patent number 7,576,425
- Issue date Aug 18, 2009
- Xintec, Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE MODULE HEAT SINK
- Publication number 20100055843
- Publication date Mar 4, 2010
- XINTEC, INC.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS

XINTEC, INC.

Organization

Patents Grantslast 30 patents

Stacked chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Semiconductor package and fabrication method thereof

IC wafer having electromagnetic shielding effects and method for ma...

Package structure and method for making the same

Image sensor package and fabrication method thereof

Conducting layer in chip package module

Patents Applicationslast 30 patents

CHIP PACKAGE MODULE HEAT SINK

Trademarklast 30 trademarks