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Yasuhiro Horiike and SpeedFam Co, Ltd.

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  • Tokyo, JP
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  • Information Patent Grant

    Wafer flattening process and system
    • Patent number 6,280,645
    • Issue date Aug 28, 2001
    • Yasuhiro Horiike and SpeedFam Co, Ltd.
    • Michihiko Yanagisawa
    • H01 - BASIC ELECTRIC ELEMENTS

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