YMT CO., LTD.

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Incheon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Carrier foil-attached metal foil, method of manufacturing the same,...
- Patent number 12,139,811
- Issue date Nov 12, 2024
- YMT CO., LTD.
- Hyun Woo Jeon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plated laminate and printed circuit board
- Patent number 11,499,233
- Issue date Nov 15, 2022
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing porous copper foil and porous copper foil prod...
- Patent number 11,028,495
- Issue date Jun 8, 2021
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing substrate formed with copper thin layer, metho...
- Patent number 9,758,889
- Issue date Sep 12, 2017
- YMT CO., LTD.
- Sung Wook Chun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for surface modification of a heat sink and method for...
- Patent number 7,981,317
- Issue date Jul 19, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Young-Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240237229
- Publication date Jul 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEVELING AGENT AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT P...
- Publication number 20240174812
- Publication date May 30, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240140905
- Publication date May 2, 2024
- YMT CO., LTD.
- Dea Geun KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240133039
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240132441
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240138075
- Publication date Apr 25, 2024
- YMT CO>< LTD.
- Sung Wook CHUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...
- Publication number 20240015885
- Publication date Jan 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MODIFIER FOR ELECTROLYTIC NICKEL PLATING AND NICKEL ELECTRO...
- Publication number 20230203693
- Publication date Jun 29, 2023
- YMT CO., LTD.
- Sung Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CARRIER FOIL-ATTACHED METAL FOIL, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230020180
- Publication date Jan 19, 2023
- YMT CO.,LTD.
- Hyun Woo JEON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATED LAMINATE AND PRINTED CIRCUIT BOARD
- Publication number 20210017650
- Publication date Jan 21, 2021
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING POROUS COPPER FOIL AND POROUS COPPER FOIL PROD...
- Publication number 20180282890
- Publication date Oct 4, 2018
- YMT CO., LTD.
- Sung Wook Chun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING SUBSTRATE FORMED WITH COPPER THIN LAYER, METHO...
- Publication number 20150327364
- Publication date Nov 12, 2015
- YMT CO., LTD.
- Sung Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING METHOD FOR PRINTED CIRCUIT BOARD
- Publication number 20140098504
- Publication date Apr 10, 2014
- YMT CO., LTD.
- Sung-Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless nickel plating solution composition, flexible printed c...
- Publication number 20100155108
- Publication date Jun 24, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Chul Min Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for plating printed circuit board and printed circuit board...
- Publication number 20070104929
- Publication date May 10, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Kyu Hyok Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Trademarklast 30 trademarks

Information Trademark
79335560 - NANOTUS
- Serial number 79335560
- Registration number 7451809
- Filing date Jan 12, 2022
- YMT CO., LTD.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry

YMT CO., LTD.

Organization

Patents Grantslast 30 patents

Carrier foil-attached metal foil, method of manufacturing the same,...

Plated laminate and printed circuit board

Method for producing porous copper foil and porous copper foil prod...

Method for producing substrate formed with copper thin layer, metho...

Composition for surface modification of a heat sink and method for...

Patents Applicationslast 30 patents

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

LEVELING AGENT AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT P...

LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...

SURFACE MODIFIER FOR ELECTROLYTIC NICKEL PLATING AND NICKEL ELECTRO...

CARRIER FOIL-ATTACHED METAL FOIL, METHOD OF MANUFACTURING THE SAME,...

PLATED LAMINATE AND PRINTED CIRCUIT BOARD

METHOD FOR PRODUCING POROUS COPPER FOIL AND POROUS COPPER FOIL PROD...

METHOD FOR PRODUCING SUBSTRATE FORMED WITH COPPER THIN LAYER, METHO...

ELECTROPLATING METHOD FOR PRINTED CIRCUIT BOARD

Electroless nickel plating solution composition, flexible printed c...

Method for plating printed circuit board and printed circuit board...

Trademarklast 30 trademarks

79335560 - NANOTUS