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A. James Hughes
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Tustin, CA, US
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Patents Grants
last 30 patents
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Patent Grant
High density 3-D integrated circuit package
Patent number
7,176,063
Issue date
Feb 13, 2007
Honeywell International Inc.
Gerard J. Sullivan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High density 3-D integrated circuit package
Patent number
6,958,533
Issue date
Oct 25, 2005
Honeywell International Inc.
Gerard J. Sullivan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Image sensor having improved moving target discernment capabilities
Patent number
4,176,369
Issue date
Nov 27, 1979
Rockwell International Corporation
Richard D. Nelson
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
High density 3-D integrated circuit package
Publication number
20050263870
Publication date
Dec 1, 2005
Honeywell International Inc.
Gerard J. Sullivan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High density 3-D integrated circuit package
Publication number
20030137059
Publication date
Jul 24, 2003
Honeywell International Inc.
Gerard J. Sullivan
H01 - BASIC ELECTRIC ELEMENTS