A. Jay Stutzman

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of providing semiconductor components within sockets
- Patent number 8,074,353
- Issue date Dec 13, 2011
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for testing microelectronic devices
- Patent number 8,063,646
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Methods of providing semiconductor components within sockets
- Patent number 8,011,092
- Issue date Sep 6, 2011
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Electrical testing apparatus having masked sockets and associated s...
- Patent number 7,857,646
- Issue date Dec 28, 2010
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for testing packaged microelectronic devices
- Patent number 7,692,437
- Issue date Apr 6, 2010
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Grant
Methods of retaining semiconductor component configurations within...
- Patent number 7,586,319
- Issue date Sep 8, 2009
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Systems configured for utilizing semiconductor components
- Patent number 7,514,945
- Issue date Apr 7, 2009
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Methods of providing semiconductor components within sockets
- Patent number 7,439,752
- Issue date Oct 21, 2008
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for testing packaged microelectronic devices
- Patent number 7,425,839
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL TESTING APPARATUS HAVING MASKED SOCKETS AND ASSOCIATED S...
- Publication number 20090273359
- Publication date Nov 5, 2009
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR TESTING PACKAGED MICROELECTRONIC DEVICES
- Publication number 20090009199
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
Methods of Retaining Semiconductor Component Configurations within...
- Publication number 20090009202
- Publication date Jan 8, 2009
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Methods of Providing Semiconductor Components within Sockets
- Publication number 20090007423
- Publication date Jan 8, 2009
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Methods of Providing Semiconductor Components within Sockets
- Publication number 20090000116
- Publication date Jan 1, 2009
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Systems Configured for Utilizing Two or More Multiple Different Sem...
- Publication number 20080088329
- Publication date Apr 17, 2008
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and methods for testing microelectronic devices
- Publication number 20080048704
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Systems and methods for testing packaged microelectronic devices
- Publication number 20080048694
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
Systems configured for utilizing two or more of multiple different...
- Publication number 20070257688
- Publication date Nov 8, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING

A. Jay Stutzman

Person

Patents Grantslast 30 patents

Methods of providing semiconductor components within sockets

Apparatus and methods for testing microelectronic devices

Methods of providing semiconductor components within sockets

Electrical testing apparatus having masked sockets and associated s...

Systems and methods for testing packaged microelectronic devices

Methods of retaining semiconductor component configurations within...

Systems configured for utilizing semiconductor components

Methods of providing semiconductor components within sockets

Systems and methods for testing packaged microelectronic devices

Patents Applicationslast 30 patents

ELECTRICAL TESTING APPARATUS HAVING MASKED SOCKETS AND ASSOCIATED S...

SYSTEMS AND METHODS FOR TESTING PACKAGED MICROELECTRONIC DEVICES

Methods of Retaining Semiconductor Component Configurations within...

Methods of Providing Semiconductor Components within Sockets

Methods of Providing Semiconductor Components within Sockets

Systems Configured for Utilizing Two or More Multiple Different Sem...

Apparatus and methods for testing microelectronic devices

Systems and methods for testing packaged microelectronic devices

Systems configured for utilizing two or more of multiple different...