A. Vethanayagam Rudge

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 9,397,016
- Issue date Jul 19, 2016
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,847,368
- Issue date Sep 30, 2014
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,258,019
- Issue date Sep 4, 2012
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20150076692
- Publication date Mar 19, 2015
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20120319276
- Publication date Dec 20, 2012
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package-on-package semiconductor device and methods of fabr...
- Publication number 20100120199
- Publication date May 13, 2010
- Bok Sim Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20090321928
- Publication date Dec 31, 2009
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS