Aaditya Candadai

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
IN CORE LARGE AREA CAPACITORS
- Publication number 20240203664
- Publication date Jun 20, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING
- Publication number 20240186197
- Publication date Jun 6, 2024
- Intel Corporation
- Aaditya Anand CANDADAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240177907
- Publication date May 30, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...
- Publication number 20240153857
- Publication date May 9, 2024
- Intel Corporation
- Bainye Francoise ANGOUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...