Aaditya Candadai

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Publication number 20250112140
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul BHURE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN CORE LARGE AREA CAPACITORS
- Publication number 20240203664
- Publication date Jun 20, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING
- Publication number 20240186197
- Publication date Jun 6, 2024
- Intel Corporation
- Aaditya Anand CANDADAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240177907
- Publication date May 30, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...
- Publication number 20240153857
- Publication date May 9, 2024
- Intel Corporation
- Bainye Francoise ANGOUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Aaditya Candadai

Person

Patents Applicationslast 30 patents

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

IN CORE LARGE AREA CAPACITORS

SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF

HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...

POROUS POLYMER DIELECTRIC LAYER ON CORE