Aakrati Jain

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Albany, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dicing Street Design for Hybrid Bonding
- Publication number 20250087629
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC OPTICAL FIBER PACKAGING
- Publication number 20250004208
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- G02 - OPTICS
Information Patent Application
DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION
- Publication number 20240321593
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER
- Publication number 20240203904
- Publication date Jun 20, 2024
- International Business Machines Corporation
- FEE LI LIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS