Aaron A. Geisberger

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Accelerometer having an over travel stop with a stop gap less than...
- Patent number 12,105,114
- Issue date Oct 1, 2024
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Accelerometer having an over travel stop with a stop gap less than...
- Patent number 11,768,220
- Issue date Sep 26, 2023
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Angular rate sensor with centrally positioned coupling structures
- Patent number 11,525,680
- Issue date Dec 13, 2022
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Angular rate sensor based on frequency modulation and drive strateg...
- Patent number 11,460,301
- Issue date Oct 4, 2022
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Angular rate sensor with in-phase drive and sense motion suppression
- Patent number 10,760,909
- Issue date Sep 1, 2020
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
MEMS device and method for calibrating a MEMS device
- Patent number 10,683,202
- Issue date Jun 16, 2020
- NXP USA, INC.
- Yean Ling Teo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with two-stage motion limit structure
- Patent number 10,502,759
- Issue date Dec 10, 2019
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Segmented electrode structure for quadrature reduction in an integr...
- Patent number 10,330,475
- Issue date Jun 25, 2019
- NXP USA, INC.
- Thierry Cassagnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with off-axis shock protection
- Patent number 10,247,753
- Issue date Apr 2, 2019
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
MEMS gyroscope device
- Patent number 10,209,070
- Issue date Feb 19, 2019
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Angular rate sensor
- Patent number 10,126,128
- Issue date Nov 13, 2018
- NXP USA, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Compensation and calibration for MEMS devices
- Patent number 9,834,438
- Issue date Dec 5, 2017
- NXP USA, INC.
- Tehmoor M. Dar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Differential capacitive output pressure sensor and method
- Patent number 9,829,406
- Issue date Nov 28, 2017
- NXP USA, INC.
- Aaron A Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
MEMS device with isolation sub-frame structure
- Patent number 9,745,189
- Issue date Aug 29, 2017
- NXP USA, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-axis inertial sensor with dual mass and integrated damping st...
- Patent number 9,720,012
- Issue date Aug 1, 2017
- NXP USA, INC.
- Jun Tang
- G01 - MEASURING TESTING
Information Patent Grant
MEMS device with isolation sub-frame structure
- Patent number 9,663,348
- Issue date May 30, 2017
- NXP USA, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded wafer structure having cavities with low pressure and method...
- Patent number 9,637,372
- Issue date May 2, 2017
- NXP USA, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with differential vertical sense electrodes
- Patent number 9,346,670
- Issue date May 24, 2016
- Freescale Semiconductor Inc.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Estimation of sidewall skew angles of a structure
- Patent number 9,316,665
- Issue date Apr 19, 2016
- Freescale Semicondcutor, Inc.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with differential vertical sense electrodes
- Patent number 9,242,851
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Compensation and calibration for MEMS devices
- Patent number 9,221,679
- Issue date Dec 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tehmoor M. Dar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with stress isolation and method of fabrication
- Patent number 9,079,763
- Issue date Jul 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with stress isolation and method of fabrication
- Patent number 8,810,030
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Spring member for use in a microelectromechanical systems sensor
- Patent number 8,413,509
- Issue date Apr 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
Accelerometer with over-travel stop structure
- Patent number 8,186,220
- Issue date May 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Grant
MEMS device with stress isolation and method of fabrication
- Patent number 8,138,007
- Issue date Mar 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with reduced sensitivity to package stress
- Patent number 8,056,415
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Calibration for automated microassembly
- Patent number 7,637,142
- Issue date Dec 29, 2009
- Zyvex Labs
- Kenneth Tsui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method, system and device for microscopic examination employing fib...
- Patent number 7,227,140
- Issue date Jun 5, 2007
- Zyvex Instruments, LLC
- George Skidmore
- G01 - MEASURING TESTING
Information Patent Grant
Sockets for microassembly
- Patent number 7,025,619
- Issue date Apr 11, 2006
- Zyvex Corporation
- Kenneth Tsui
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS ACCELEROMETER WITH VERTICAL STOPS
- Publication number 20240329076
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Jun Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELEROMETER HAVING AN OVER TRAVEL STOP WITH A STOP GAP LESS THAN...
- Publication number 20230266358
- Publication date Aug 24, 2023
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
ACCELEROMETER HAVING AN OVER TRAVEL STOP WITH A STOP GAP LESS THAN...
- Publication number 20230074541
- Publication date Mar 9, 2023
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
ANGULAR RATE SENSOR BASED ON FREQUENCY MODULATION AND DRIVE STRATEG...
- Publication number 20220282972
- Publication date Sep 8, 2022
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
ANGULAR RATE SENSOR WITH CENTRALLY POSITIONED COUPLING STRUCTURES
- Publication number 20220260372
- Publication date Aug 18, 2022
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
MEMS ANGULAR RATE SENSOR WITH IN-PHASE DRIVE AND SENSE MOTION SUPPR...
- Publication number 20190383612
- Publication date Dec 19, 2019
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE WITH TWO-STAGE MOTION LIMIT STRUCTURE
- Publication number 20190120872
- Publication date Apr 25, 2019
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE WITH IN-PLANE QUADRATURE COMPENSATION
- Publication number 20180252526
- Publication date Sep 6, 2018
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE WITH OFF-AXIS SHOCK PROTECTION
- Publication number 20180231579
- Publication date Aug 16, 2018
- NXP USA, Inc.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
INERTIAL SENSOR WITH MOTION LIMIT STRUCTURE
- Publication number 20180180419
- Publication date Jun 28, 2018
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE AND METHOD FOR CALIBRATING A MEMS DEVICE
- Publication number 20180141805
- Publication date May 24, 2018
- NXP USA, Inc.
- Yean Ling Teo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEGMENTED ELECTRODE STRUCTURE FOR QUADRATURE REDUCTION IN AN INTEGR...
- Publication number 20180017387
- Publication date Jan 18, 2018
- NXP USA, Inc.
- Thierry Cassagnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS GYROSCOPE DEVICE
- Publication number 20170350701
- Publication date Dec 7, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
ANGULAR RATE SENSOR
- Publication number 20170343350
- Publication date Nov 30, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE WITH ISOLATION SUB-FRAME STRUCTURE
- Publication number 20170225949
- Publication date Aug 10, 2017
- NXP USA, Inc.
- Aaron A. GEISBERGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH ISOLATION SUB-FRAME STRUCTURE
- Publication number 20170129769
- Publication date May 11, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFERENTIAL CAPACITIVE OUTPUT PRESSURE SENSOR AND METHOD
- Publication number 20170074738
- Publication date Mar 16, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. GEISBERGER
- G01 - MEASURING TESTING
Information Patent Application
MULTI-AXIS INERTIAL SENSOR WITH DUAL MASS AND INTEGRATED DAMPING ST...
- Publication number 20170023608
- Publication date Jan 26, 2017
- FREESCALE SEMICONDUCTOR, INC.
- JUN TANG
- G01 - MEASURING TESTING
Information Patent Application
BONDED WAFER STRUCTURE HAVING CAVITIES WITH LOW PRESSURE AND METHOD...
- Publication number 20160311676
- Publication date Oct 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. STEIMLE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPENSATION AND CALIBRATION FOR MEMS DEVICES
- Publication number 20160167961
- Publication date Jun 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tehmoor M. Dar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DIFFERENTIAL VERTICAL SENSE ELECTRODES
- Publication number 20160083249
- Publication date Mar 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DIFFERENTIAL VERTICAL SENSE ELECTRODES
- Publication number 20150041927
- Publication date Feb 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION
- Publication number 20140312435
- Publication date Oct 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ESTIMATION OF SIDEWALL SKEW ANGLES OF A STRUCTURE
- Publication number 20140311243
- Publication date Oct 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPENSATION AND CALIBRATION FOR MEMS DEVICES
- Publication number 20140260508
- Publication date Sep 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Tehmoor M. Dar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION
- Publication number 20120126345
- Publication date May 24, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION
- Publication number 20110049648
- Publication date Mar 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELEROMETER WITH OVER-TRAVEL STOP STRUCTURE
- Publication number 20100223997
- Publication date Sep 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED SENSITIVITY TO PACKAGE STRESS
- Publication number 20090293617
- Publication date Dec 3, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SPRING MEMBER FOR USE IN A MICROELECTROMECHANICAL SYSTEMS SENSOR
- Publication number 20090256297
- Publication date Oct 15, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Aaron A. Geisberger
- G01 - MEASURING TESTING

Aaron A. Geisberger

Person

Patents Grantslast 30 patents

Accelerometer having an over travel stop with a stop gap less than...

Accelerometer having an over travel stop with a stop gap less than...

Angular rate sensor with centrally positioned coupling structures

Angular rate sensor based on frequency modulation and drive strateg...

Angular rate sensor with in-phase drive and sense motion suppression

MEMS device and method for calibrating a MEMS device

MEMS device with two-stage motion limit structure

Segmented electrode structure for quadrature reduction in an integr...

MEMS device with off-axis shock protection

MEMS gyroscope device

Angular rate sensor

Compensation and calibration for MEMS devices

Differential capacitive output pressure sensor and method

MEMS device with isolation sub-frame structure

Multi-axis inertial sensor with dual mass and integrated damping st...

MEMS device with isolation sub-frame structure

Bonded wafer structure having cavities with low pressure and method...

MEMS device with differential vertical sense electrodes

Estimation of sidewall skew angles of a structure

MEMS device with differential vertical sense electrodes

Compensation and calibration for MEMS devices

MEMS device with stress isolation and method of fabrication

MEMS device with stress isolation and method of fabrication

Spring member for use in a microelectromechanical systems sensor

Accelerometer with over-travel stop structure

MEMS device with stress isolation and method of fabrication

Semiconductor device with reduced sensitivity to package stress

Calibration for automated microassembly

Method, system and device for microscopic examination employing fib...

Sockets for microassembly

Patents Applicationslast 30 patents

MEMS ACCELEROMETER WITH VERTICAL STOPS

ACCELEROMETER HAVING AN OVER TRAVEL STOP WITH A STOP GAP LESS THAN...

ACCELEROMETER HAVING AN OVER TRAVEL STOP WITH A STOP GAP LESS THAN...

ANGULAR RATE SENSOR BASED ON FREQUENCY MODULATION AND DRIVE STRATEG...

ANGULAR RATE SENSOR WITH CENTRALLY POSITIONED COUPLING STRUCTURES

MEMS ANGULAR RATE SENSOR WITH IN-PHASE DRIVE AND SENSE MOTION SUPPR...

MEMS DEVICE WITH TWO-STAGE MOTION LIMIT STRUCTURE

MEMS DEVICE WITH IN-PLANE QUADRATURE COMPENSATION

MEMS DEVICE WITH OFF-AXIS SHOCK PROTECTION

INERTIAL SENSOR WITH MOTION LIMIT STRUCTURE

MEMS DEVICE AND METHOD FOR CALIBRATING A MEMS DEVICE

SEGMENTED ELECTRODE STRUCTURE FOR QUADRATURE REDUCTION IN AN INTEGR...

MEMS GYROSCOPE DEVICE

ANGULAR RATE SENSOR

MEMS DEVICE WITH ISOLATION SUB-FRAME STRUCTURE

MEMS DEVICE WITH ISOLATION SUB-FRAME STRUCTURE

DIFFERENTIAL CAPACITIVE OUTPUT PRESSURE SENSOR AND METHOD

MULTI-AXIS INERTIAL SENSOR WITH DUAL MASS AND INTEGRATED DAMPING ST...

BONDED WAFER STRUCTURE HAVING CAVITIES WITH LOW PRESSURE AND METHOD...

COMPENSATION AND CALIBRATION FOR MEMS DEVICES

MEMS DEVICE WITH DIFFERENTIAL VERTICAL SENSE ELECTRODES

MEMS DEVICE WITH DIFFERENTIAL VERTICAL SENSE ELECTRODES

MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION

ESTIMATION OF SIDEWALL SKEW ANGLES OF A STRUCTURE

COMPENSATION AND CALIBRATION FOR MEMS DEVICES

MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION

MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION

ACCELEROMETER WITH OVER-TRAVEL STOP STRUCTURE

SEMICONDUCTOR DEVICE WITH REDUCED SENSITIVITY TO PACKAGE STRESS

SPRING MEMBER FOR USE IN A MICROELECTROMECHANICAL SYSTEMS SENSOR