Aaron CADAG

Person

Calamba, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Lead stabilization in semiconductor packages
- Patent number 12,211,774
- Issue date Jan 28, 2025
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapeless leadframe package with exposed integrated circuit die
- Patent number 11,916,090
- Issue date Feb 27, 2024
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interlocking leads and manufacturing the same
- Patent number 11,557,548
- Issue date Jan 17, 2023
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadless semiconductor package with wettable flanks
- Patent number 11,069,601
- Issue date Jul 20, 2021
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,910,295
- Issue date Feb 2, 2021
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interlocking leads and manufacturing the same
- Patent number 10,903,172
- Issue date Jan 26, 2021
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,541,196
- Issue date Jan 21, 2020
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interlocking leads and manufacturing the same
- Patent number 10,529,672
- Issue date Jan 7, 2020
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 10,483,191
- Issue date Nov 19, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with backside protective layer during molding to prevent mo...
- Patent number 10,461,019
- Issue date Oct 29, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with backside protective layer during molding to prevent mo...
- Patent number 10,128,169
- Issue date Nov 13, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,079,198
- Issue date Sep 18, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow over wire die attach film and conductive molding compound to p...
- Patent number 9,953,933
- Issue date Apr 24, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensating mold plunger for integrated circuit manufacture
- Patent number 9,022,773
- Issue date May 5, 2015
- STMicroelectronics, Inc.
- Aaron Cadag
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20240178006
- Publication date May 30, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE
- Publication number 20220005857
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...
- Publication number 20210391226
- Publication date Dec 16, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20210313255
- Publication date Oct 7, 2021
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME
- Publication number 20210118818
- Publication date Apr 22, 2021
- STMICROELECTRONICS, INC.
- Aaron Cadag.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
- Publication number 20200343168
- Publication date Oct 29, 2020
- STMicroelectronics, Inc.
- Ela Mia CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...
- Publication number 20200135623
- Publication date Apr 30, 2020
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME
- Publication number 20200118944
- Publication date Apr 16, 2020
- STMicroelectronics, Inc.
- Aaron Cadag.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20200020616
- Publication date Jan 16, 2020
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20190267311
- Publication date Aug 29, 2019
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME
- Publication number 20190067212
- Publication date Feb 28, 2019
- STMicroelectronics, Inc.
- Aaron Cadag.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...
- Publication number 20190019745
- Publication date Jan 17, 2019
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...
- Publication number 20180358286
- Publication date Dec 13, 2018
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...
- Publication number 20180331020
- Publication date Nov 15, 2018
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20180016133
- Publication date Jan 18, 2018
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS
- Publication number 20150179477
- Publication date Jun 25, 2015
- STMicroelectronics, Inc.
- AARON CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATING MOLD PLUNGER FOR INTEGRATED CIRCUIT MANUFACTURE
- Publication number 20130168898
- Publication date Jul 4, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Aaron CADAG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Aaron CADAG

Person

Patents Grantslast 30 patents

Lead stabilization in semiconductor packages

Method for manufacturing leadless semiconductor package with wettab...

Tapeless leadframe package with exposed integrated circuit die

Package with interlocking leads and manufacturing the same

Bottom package exposed die MEMS pressure sensor integrated circuit...

Leadless semiconductor package with wettable flanks

QFN pre-molded leadframe having a solder wettable sidewall on each...

Package with interlocking leads and manufacturing the same

QFN pre-molded leadframe having a solder wettable sidewall on each...

Package with interlocking leads and manufacturing the same

Bottom package exposed die MEMS pressure sensor integrated circuit...

Package with backside protective layer during molding to prevent mo...

Package with backside protective layer during molding to prevent mo...

QFN pre-molded leadframe having a solder wettable sidewall on each...

Flow over wire die attach film and conductive molding compound to p...

Compensating mold plunger for integrated circuit manufacture

Patents Applicationslast 30 patents

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE

SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME

LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES

QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...

PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME

PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...

QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...

PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS

COMPENSATING MOLD PLUNGER FOR INTEGRATED CIRCUIT MANUFACTURE