Aaron Eppler

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for determining field non-uniformities of a wafer...
- Patent number 10,763,142
- Issue date Sep 1, 2020
- Lam Research Corporation
- Marcus Musselman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer profile control using atomic layer deposition in a multiple...
- Patent number 10,446,394
- Issue date Oct 15, 2019
- Lam Research Corporation
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch of oxide metal oxide metal stack
- Patent number 10,242,883
- Issue date Mar 26, 2019
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and apparatus for ion milling in a plasma etch chamber
- Patent number 9,899,227
- Issue date Feb 20, 2018
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch with combination mask
- Patent number 9,659,783
- Issue date May 23, 2017
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch with combination mask
- Patent number 9,018,103
- Issue date Apr 28, 2015
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist conditioning with hydrogen ramping
- Patent number 7,682,480
- Issue date Mar 23, 2010
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control
- Patent number 7,645,707
- Issue date Jan 12, 2010
- Lam Research Corporation
- Camelia Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching dielectric films with improved resist and/or et...
- Patent number 7,547,635
- Issue date Jun 16, 2009
- Lam Research Corporation
- Aaron Eppler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative bias critical dimension trim
- Patent number 7,544,521
- Issue date Jun 9, 2009
- Lam Research Corporation
- Scott Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple frequency plasma processor method and apparatus
- Patent number 7,405,521
- Issue date Jul 29, 2008
- Lam Research Corporation
- Raj Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch with ramping
- Patent number 7,135,410
- Issue date Nov 14, 2006
- Lam Research Corporation
- Keren Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist conditioning with hydrogen ramping
- Patent number 7,053,003
- Issue date May 30, 2006
- Lam Research Corporation
- Karen Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable temperature processes for tunable electrostatic chuck
- Patent number 6,921,724
- Issue date Jul 26, 2005
- Lam Research Corporation
- Tom A. Kamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped upper electrode for plasma processing uniformity
- Patent number 6,824,627
- Issue date Nov 30, 2004
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped upper electrode for plasma processing uniformity
- Patent number 6,391,787
- Issue date May 21, 2002
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPACER PROFILE CONTROL USING ATOMIC LAYER DEPOSITION IN A MULTIPLE...
- Publication number 20190237330
- Publication date Aug 1, 2019
- LAM RESEARCH CORPORATION
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO ETCH OF OXIDE METAL OXIDE METAL STACK
- Publication number 20180374712
- Publication date Dec 27, 2018
- LAM RESEARCH CORPORATION
- Joydeep GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Separately Applying Charged Plasma Constitu...
- Publication number 20170040170
- Publication date Feb 9, 2017
- LAM RESEARCH CORPORATION
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING FIELD NON-UNIFORMITIES OF A WAFER...
- Publication number 20160370796
- Publication date Dec 22, 2016
- LAM RESEARCH CORPORATION
- Marcus Musselman
- G05 - CONTROLLING REGULATING
Information Patent Application
HIGH ASPECT RATIO ETCH WITH COMBINATION MASK
- Publication number 20150200106
- Publication date Jul 16, 2015
- LAM RESEARCH CORPORATION
- Joydeep GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO ETCH WITH COMBINATION MASK
- Publication number 20150087154
- Publication date Mar 26, 2015
- LAM RESEARCH CORPORATION
- Joydeep GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR ION MILLING IN A PLASMA ETCH CHAMBER
- Publication number 20140235056
- Publication date Aug 21, 2014
- LAM RESEARCH CORPORATION
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK OPEN AND ETCH PROFILE CONTROL WITH HARDMASK OPEN
- Publication number 20100327413
- Publication date Dec 30, 2010
- LAM RESEARCH CORPORATION
- Jong Pil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch profile control
- Publication number 20060226120
- Publication date Oct 12, 2006
- Lam Research Corporation
- Camelia Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist conditioning with hydrogen ramping
- Publication number 20060124242
- Publication date Jun 15, 2006
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST CONDITIONING WITH HYDROGEN RAMPING
- Publication number 20060089005
- Publication date Apr 27, 2006
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch with ramping
- Publication number 20050070117
- Publication date Mar 31, 2005
- Lam Research Corporation
- Keren Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple frequency plasma etch reactor
- Publication number 20050039682
- Publication date Feb 24, 2005
- Raj Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for etching dielectric films with improved resist and/or et...
- Publication number 20030232504
- Publication date Dec 18, 2003
- Aaron Eppler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable temperature processes for tunable electrostatic chuck
- Publication number 20030186545
- Publication date Oct 2, 2003
- Lam Research Corporation, a Delaware Corporation
- Tom A. Kamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stepped upper electrode for plasma processing uniformity
- Publication number 20020187647
- Publication date Dec 12, 2002
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS

Aaron Eppler

Person

Patents Grantslast 30 patents

System and method for determining field non-uniformities of a wafer...

Spacer profile control using atomic layer deposition in a multiple...

High aspect ratio etch of oxide metal oxide metal stack

System, method and apparatus for ion milling in a plasma etch chamber

High aspect ratio etch with combination mask

High aspect ratio etch with combination mask

Photoresist conditioning with hydrogen ramping

Etch profile control

Process for etching dielectric films with improved resist and/or et...

Negative bias critical dimension trim

Multiple frequency plasma processor method and apparatus

Etch with ramping

Photoresist conditioning with hydrogen ramping

Variable temperature processes for tunable electrostatic chuck

Stepped upper electrode for plasma processing uniformity

Stepped upper electrode for plasma processing uniformity

Patents Applicationslast 30 patents

SPACER PROFILE CONTROL USING ATOMIC LAYER DEPOSITION IN A MULTIPLE...

HIGH ASPECT RATIO ETCH OF OXIDE METAL OXIDE METAL STACK

Systems and Methods for Separately Applying Charged Plasma Constitu...

SYSTEM AND METHOD FOR DETERMINING FIELD NON-UNIFORMITIES OF A WAFER...

HIGH ASPECT RATIO ETCH WITH COMBINATION MASK

HIGH ASPECT RATIO ETCH WITH COMBINATION MASK

SYSTEM, METHOD AND APPARATUS FOR ION MILLING IN A PLASMA ETCH CHAMBER

HARDMASK OPEN AND ETCH PROFILE CONTROL WITH HARDMASK OPEN

Etch profile control

Photoresist conditioning with hydrogen ramping

PHOTORESIST CONDITIONING WITH HYDROGEN RAMPING

Etch with ramping

Multiple frequency plasma etch reactor

Process for etching dielectric films with improved resist and/or et...

Variable temperature processes for tunable electrostatic chuck

Stepped upper electrode for plasma processing uniformity