Aaron Fitzsimmons

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Chattanooga, TN, US

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Patents Grantslast 30 patents

Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 11,309,251
- Issue date Apr 19, 2022
- AdTech Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-CERAMIC MIXED PACKAGE SUBSTRATE PLATED WITH NON-MAGNETIC LAYE...
- Publication number 20240304539
- Publication date Sep 12, 2024
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METALLIZATION OF INTEGRATED CIRCUIT PACKAGES
- Publication number 20220344269
- Publication date Oct 27, 2022
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METALLIZATION OF INTEGRATED CIRCUIT PACKAGES
- Publication number 20190035735
- Publication date Jan 31, 2019
- AdTech Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS