Aaron MCCANN

Person

Queen Creek, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-optimized tunable stack in cavity package-on-package
- Patent number 11,769,753
- Issue date Sep 26, 2023
- Intel Corporation
- George Vakanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20230128903
- Publication date Apr 27, 2023
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HEAT SPREADER
- Publication number 20210272885
- Publication date Sep 2, 2021
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20210257277
- Publication date Aug 19, 2021
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL PACKAGE VAPOR CHAMBER WITH IHS
- Publication number 20210195798
- Publication date Jun 24, 2021
- Intel Corporation
- Nicholas NEAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210134698
- Publication date May 6, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLED LIQUID METAL THERMAL INTERFACE MATERIALS
- Publication number 20210125896
- Publication date Apr 29, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION
- Publication number 20210101175
- Publication date Apr 8, 2021
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE
- Publication number 20200043894
- Publication date Feb 6, 2020
- Intel Corporation
- George VAKANAS
- H01 - BASIC ELECTRIC ELEMENTS

Aaron MCCANN

Person

Patents Grantslast 30 patents

Enhanced base die heat path using through-silicon vias

Thermal interface structures for integrated circuit packages

Enhanced base die heat path using through-silicon vias

Full package vapor chamber with IHS

Thermally-optimized tunable stack in cavity package-on-package

Liquid metal thermal interface material application

Patents Applicationslast 30 patents

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

INTERPOSER HEAT SPREADER

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

FULL PACKAGE VAPOR CHAMBER WITH IHS

THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES

FILLED LIQUID METAL THERMAL INTERFACE MATERIALS

LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION

THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE