Aaron R. Wilson

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,744,076
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,563,024
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,380,705
- Issue date Jul 5, 2022
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending strings of memory cells individually compri...
- Patent number 10,615,174
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending strings of memory cells individually compri...
- Patent number 10,381,377
- Issue date Aug 13, 2019
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending strings of memory cells individually compri...
- Patent number 10,121,799
- Issue date Nov 6, 2018
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending strings of memory cells individually compri...
- Patent number 9,893,083
- Issue date Feb 13, 2018
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated structures, and methods of formin...
- Patent number 9,305,938
- Issue date Apr 5, 2016
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices having recesses
- Patent number 9,219,001
- Issue date Dec 22, 2015
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming vertically-stacked memory cells
- Patent number 9,136,278
- Issue date Sep 15, 2015
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated structures, and methods of formin...
- Patent number 8,946,076
- Issue date Feb 3, 2015
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemistry and compositions for manufacturing integrated circuits
- Patent number 8,759,228
- Issue date Jun 24, 2014
- Micron Technology, Inc.
- Aaron Wilson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor structures including dual fins
- Patent number 8,497,530
- Issue date Jul 30, 2013
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using positive DC offset of bias RF to neutralize charge build-up o...
- Patent number 8,419,958
- Issue date Apr 16, 2013
- Micron Technology, Inc.
- Aaron R. Wilson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor structures including dual fins
- Patent number 8,138,526
- Issue date Mar 20, 2012
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio contacts
- Patent number 8,093,725
- Issue date Jan 10, 2012
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions of memory devices with different sizes...
- Patent number 7,948,030
- Issue date May 24, 2011
- Micron Technology, Inc.
- Larson Lindholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices including dual fin str...
- Patent number 7,879,659
- Issue date Feb 1, 2011
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching features into substrates
- Patent number 7,857,982
- Issue date Dec 28, 2010
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions of memory device with different depth g...
- Patent number 7,808,041
- Issue date Oct 5, 2010
- Micron Technology, Inc.
- Larson Lindholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using positive DC offset of bias RF to neutralize charge build-up o...
- Patent number 7,713,430
- Issue date May 11, 2010
- Micron Technology, Inc.
- Aaron R. Wilson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Etching methods
- Patent number 7,670,958
- Issue date Mar 2, 2010
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor constructions, and methods of rece...
- Patent number 7,648,915
- Issue date Jan 19, 2010
- Micron Technology, Inc.
- Larson Lindholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio contacts
- Patent number 7,608,195
- Issue date Oct 27, 2009
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a capacitor
- Patent number 7,358,146
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a capacitor
- Patent number 7,276,409
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a capacitor
- Patent number 6,933,193
- Issue date Aug 23, 2005
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming uniform sharp tips for use in a field emission a...
- Patent number 6,753,643
- Issue date Jun 22, 2004
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming uniform sharp tips for use in a field emission a...
- Patent number 6,689,282
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning high density field emitter tips
- Patent number 6,679,998
- Issue date Jan 20, 2004
- Micron Technology, Inc.
- Eric J. Knappenberger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230118763
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20220293631
- Publication date Sep 15, 2022
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220068952
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210249433
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevationally-Extending Strings Of Memory Cells Individually Compri...
- Publication number 20190312056
- Publication date Oct 10, 2019
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevationally-Extending Strings Of Memory Cells Individually Compri...
- Publication number 20180331120
- Publication date Nov 15, 2018
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevationally-Extending Strings Of Memory Cells Individually Compri...
- Publication number 20180114795
- Publication date Apr 26, 2018
- Micron Technology, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Fabricating Integrated Structures, and Methods of Formin...
- Publication number 20150348991
- Publication date Dec 3, 2015
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Fabricating Integrated Structures, and Methods of Formin...
- Publication number 20150140753
- Publication date May 21, 2015
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Fabricating Integrated Structures, and Methods of Formin...
- Publication number 20140273462
- Publication date Sep 18, 2014
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemistry and Compositions for Manufacturing Integrated Circuits
- Publication number 20140264152
- Publication date Sep 18, 2014
- Micron Technology, Inc.
- Aaron R. Wilson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING RECESSES
- Publication number 20130309839
- Publication date Nov 21, 2013
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING POSITIVE DC OFFSET OF BIAS RF TO NEUTRALIZE CHARGE BUILD-UP O...
- Publication number 20130220549
- Publication date Aug 29, 2013
- Micron Technology, Inc.
- Aaron R. Wilson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING DUAL FINS AND METHODS OF FABRICA...
- Publication number 20120175748
- Publication date Jul 12, 2012
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CONTACTS
- Publication number 20120104550
- Publication date May 3, 2012
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING DUAL FINS
- Publication number 20110057269
- Publication date Mar 10, 2011
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20100327369
- Publication date Dec 30, 2010
- Micron Technology, Inc.
- Larson Lindholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using Positive DC Offset of Bias RF to Neutralize Charge Build-Up o...
- Publication number 20100213172
- Publication date Aug 26, 2010
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20100072557
- Publication date Mar 25, 2010
- Micron Technology, Inc.
- Larson Lindholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CONTACTS
- Publication number 20100038796
- Publication date Feb 18, 2010
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRY AND COMPOSITIONS FOR MANUFACTURING INTEGRATED CIRCUITS
- Publication number 20090093125
- Publication date Apr 9, 2009
- Micron Technology, Inc.
- Aaron Wilson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS OF FABRICATING DUAL FIN STRUCTURES AND SEMICONDUCTOR DEVICE...
- Publication number 20090026530
- Publication date Jan 29, 2009
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor constructions, methods of forming semiconductor const...
- Publication number 20080169504
- Publication date Jul 17, 2008
- Micron Technology, Inc.
- Larson Lindholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using positive DC offset of bias RF to neutralize charge build-up o...
- Publication number 20070193975
- Publication date Aug 23, 2007
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High aspect ratio contacts
- Publication number 20070197033
- Publication date Aug 23, 2007
- Micron Technology, Inc.
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching methods, RIE methods, and methods of increasing the stabili...
- Publication number 20070034603
- Publication date Feb 15, 2007
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of etching features into substrates
- Publication number 20070020936
- Publication date Jan 25, 2007
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A CAPACITORS -
- Publication number 20060024904
- Publication date Feb 2, 2006
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a capacitor
- Publication number 20060024907
- Publication date Feb 2, 2006
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching methods, RIE methods, and methods of increasing the stabili...
- Publication number 20040219790
- Publication date Nov 4, 2004
- Aaron R. Wilson
- H01 - BASIC ELECTRIC ELEMENTS

Aaron R. Wilson

Person

Patents Grantslast 30 patents

Integrated assemblies, and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies, and methods of forming integrated assemblies

Elevationally-extending strings of memory cells individually compri...

Elevationally-extending strings of memory cells individually compri...

Elevationally-extending strings of memory cells individually compri...

Elevationally-extending strings of memory cells individually compri...

Methods of fabricating integrated structures, and methods of formin...

Methods of forming semiconductor devices having recesses

Methods of forming vertically-stacked memory cells

Methods of fabricating integrated structures, and methods of formin...

Chemistry and compositions for manufacturing integrated circuits

Semiconductor structures including dual fins

Using positive DC offset of bias RF to neutralize charge build-up o...

Semiconductor structures including dual fins

High aspect ratio contacts

Semiconductor constructions of memory devices with different sizes...

Methods of fabricating semiconductor devices including dual fin str...

Methods of etching features into substrates

Semiconductor constructions of memory device with different depth g...

Using positive DC offset of bias RF to neutralize charge build-up o...

Etching methods

Methods of forming semiconductor constructions, and methods of rece...

High aspect ratio contacts

Method of forming a capacitor

Method of forming a capacitor

Method of forming a capacitor

Method for forming uniform sharp tips for use in a field emission a...

Method for forming uniform sharp tips for use in a field emission a...

Method for patterning high density field emitter tips

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Elevationally-Extending Strings Of Memory Cells Individually Compri...

Elevationally-Extending Strings Of Memory Cells Individually Compri...

Elevationally-Extending Strings Of Memory Cells Individually Compri...

Methods of Fabricating Integrated Structures, and Methods of Formin...

Methods of Fabricating Integrated Structures, and Methods of Formin...

Methods of Fabricating Integrated Structures, and Methods of Formin...

Chemistry and Compositions for Manufacturing Integrated Circuits

METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING RECESSES

USING POSITIVE DC OFFSET OF BIAS RF TO NEUTRALIZE CHARGE BUILD-UP O...

SEMICONDUCTOR STRUCTURES INCLUDING DUAL FINS AND METHODS OF FABRICA...

HIGH ASPECT RATIO CONTACTS

SEMICONDUCTOR STRUCTURES INCLUDING DUAL FINS

Semiconductor Constructions

Using Positive DC Offset of Bias RF to Neutralize Charge Build-Up o...

Semiconductor Constructions

HIGH ASPECT RATIO CONTACTS

CHEMISTRY AND COMPOSITIONS FOR MANUFACTURING INTEGRATED CIRCUITS

METHODS OF FABRICATING DUAL FIN STRUCTURES AND SEMICONDUCTOR DEVICE...

Semiconductor constructions, methods of forming semiconductor const...

Using positive DC offset of bias RF to neutralize charge build-up o...

High aspect ratio contacts

Etching methods, RIE methods, and methods of increasing the stabili...

Methods of etching features into substrates

METHODS OF FORMING A CAPACITORS -

Method of forming a capacitor

Etching methods, RIE methods, and methods of increasing the stabili...