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Aaron Wang
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Hsin Chu City, TW
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last 30 patents
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Patent Grant
Top via pattern for bond pad structure
Patent number
7,323,784
Issue date
Jan 29, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Ho-Yin Yiu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Top via pattern for bond pad structure
Publication number
20060208360
Publication date
Sep 21, 2006
Taiwan Semiconductor Manufacturing Co., Ltd.
Ho-Yin Yiu
H01 - BASIC ELECTRIC ELEMENTS