Aastha Uppal

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device having shielding/containment extensions
- Patent number 12,048,123
- Issue date Jul 23, 2024
- Intel Corporation
- Aastha Uppal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate heat sink for bottom side cooling
- Patent number 11,830,783
- Issue date Nov 28, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-optimized tunable stack in cavity package-on-package
- Patent number 11,769,753
- Issue date Sep 26, 2023
- Intel Corporation
- George Vakanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active package cooling structures using molded substrate packaging...
- Patent number 11,735,495
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar Karhade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit assemblies having metal foam structures
- Patent number 11,721,607
- Issue date Aug 8, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric coolers combined with phase-change material in integ...
- Patent number 11,676,883
- Issue date Jun 13, 2023
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change materials for electromagnetic interference shielding a...
- Patent number 11,664,294
- Issue date May 30, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package (PoP) with solder array thermal contacts
- Patent number 11,387,175
- Issue date Jul 12, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for inspection of a package assembly with a thermal solution
- Patent number 10,600,699
- Issue date Mar 24, 2020
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...
- Publication number 20210391244
- Publication date Dec 16, 2021
- Intel Corporation
- Chandra Mohan JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COOLING USING HEAT PIPE VAPOR CHAMBER STIFFENER AND IHS LEGS
- Publication number 20210259134
- Publication date Aug 19, 2021
- Intel Corporation
- Aastha UPPAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...
- Publication number 20210249326
- Publication date Aug 12, 2021
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES
- Publication number 20210233832
- Publication date Jul 29, 2021
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE HAVING SHIELDING/CONTAINMENT EXTENSIONS
- Publication number 20210235596
- Publication date Jul 29, 2021
- Intel Corporation
- Aastha Uppal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING
- Publication number 20210111091
- Publication date Apr 15, 2021
- Intel Corporation
- Aastha UPPAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...
- Publication number 20200294884
- Publication date Sep 17, 2020
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
- Publication number 20200273811
- Publication date Aug 27, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PACKAGE COOLING STRUCTURES USING MOLDED SUBSTRATE PACKAGING...
- Publication number 20200273775
- Publication date Aug 27, 2020
- Intel Corporation
- Omkar Karhade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...
- Publication number 20200273768
- Publication date Aug 27, 2020
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
- Publication number 20200273772
- Publication date Aug 27, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200227332
- Publication date Jul 16, 2020
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...
- Publication number 20200219789
- Publication date Jul 9, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIALS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING A...
- Publication number 20200219790
- Publication date Jul 9, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS
- Publication number 20200051899
- Publication date Feb 13, 2020
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE
- Publication number 20200043894
- Publication date Feb 6, 2020
- Intel Corporation
- George VAKANAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION
- Publication number 20190067135
- Publication date Feb 28, 2019
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING

Aastha Uppal

Person

Patents Grantslast 30 patents

Heat dissipation device having shielding/containment extensions

Thermally enhanced silicon back end layers for improved thermal per...

Embedded substrate heat sink for bottom side cooling

Thermally-optimized tunable stack in cavity package-on-package

Active package cooling structures using molded substrate packaging...

Integrated circuit assemblies having metal foam structures

Thermoelectric coolers combined with phase-change material in integ...

Phase change materials for electromagnetic interference shielding a...

Coupled cooling fins in ultra-small systems

Thermal management solutions for integrated circuit packages

Interposer package-on-package (PoP) with solder array thermal contacts

Apparatus for inspection of a package assembly with a thermal solution

Patents Applicationslast 30 patents

THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...

SUBSTRATE COOLING USING HEAT PIPE VAPOR CHAMBER STIFFENER AND IHS LEGS

HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...

INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES

HEAT DISSIPATION DEVICE HAVING SHIELDING/CONTAINMENT EXTENSIONS

EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING

THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...

IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE

ACTIVE PACKAGE COOLING STRUCTURES USING MOLDED SUBSTRATE PACKAGING...

CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...

COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...

PHASE CHANGE MATERIALS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING A...

INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS

THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE

APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION