Abdolreza LANGARI

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 11,670,614
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising first solder interconnects aligned in a first dir...
- Patent number 11,437,307
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Abdolreza Langari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising first solder interconnects aligned in a first dir...
- Patent number 10,916,494
- Issue date Feb 9, 2021
- QUALCOMM Incorporated
- Abdolreza Langari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
- Publication number 20230260947
- Publication date Aug 17, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
- Publication number 20220108968
- Publication date Apr 7, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) COUPLED TO FRONT SIDE OF INTEGRATED...
- Publication number 20210210452
- Publication date Jul 8, 2021
- QUALCOMM Incorporated
- Abdolreza LANGARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIR...
- Publication number 20210066177
- Publication date Mar 4, 2021
- QUALCOMM Incorporated
- Abdolreza LANGARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIR...
- Publication number 20200211943
- Publication date Jul 2, 2020
- QUALCOMM Incorporated
- Abdolreza LANGARI
- H01 - BASIC ELECTRIC ELEMENTS