Abelardo Hadap Advincula, JR.

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with exposed terminal interconn...
- Patent number 7,919,850
- Issue date Apr 5, 2011
- Stats Chippac Ltd.
- Arnel Senosa Trasporto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system with leads
- Patent number 7,868,471
- Issue date Jan 11, 2011
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with isloated leads
- Patent number 7,732,901
- Issue date Jun 8, 2010
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE
- Publication number 20090085181
- Publication date Apr 2, 2009
- Abelardo Hadap Advincula, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTERNAL INTERCONNECTS AT HI...
- Publication number 20090072365
- Publication date Mar 19, 2009
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS