Abelardo Jr. Hadap Advincula

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with package integration
- Patent number 8,258,614
- Issue date Sep 4, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with package encapsulation having...
- Patent number 8,129,827
- Issue date Mar 6, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with dual row lead-frame having...
- Patent number 8,115,287
- Issue date Feb 14, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with multiple die
- Patent number 8,067,825
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Abelardo Jr. Hadap Advincula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with multiple devices
- Patent number 7,919,848
- Issue date Apr 5, 2011
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable integrated circuit package system with exposed external i...
- Patent number 7,785,929
- Issue date Aug 31, 2010
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL ROW LEAD-FRAME HAVING...
- Publication number 20110140252
- Publication date Jun 16, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED TERMINAL INTERCONN...
- Publication number 20100140789
- Publication date Jun 10, 2010
- Arnel Senosa Trasporto
- H01 - BASIC ELECTRIC ELEMENTS