Abhay W. Watwe

Person

Chander, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 7,432,532
- Issue date Oct 7, 2008
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 7,170,098
- Issue date Jan 30, 2007
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with high capacity thermal interface and method...
- Patent number 7,098,079
- Issue date Aug 29, 2006
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 6,921,706
- Issue date Jul 26, 2005
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 6,770,966
- Issue date Aug 3, 2004
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,661,660
- Issue date Dec 9, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with high capacity thermal interface
- Patent number 6,653,730
- Issue date Nov 25, 2003
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,639,799
- Issue date Oct 28, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal cooling apparatus
- Patent number 6,504,721
- Issue date Jan 7, 2003
- Intel Corporation
- Abhay Watwe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink with a heat pipe for spreading of heat
- Patent number 6,189,601
- Issue date Feb 20, 2001
- Intel Corporation
- Lloyd Jack Goodman
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Electronic assembly including a die having an integrated circuit an...
- Publication number 20060270135
- Publication date Nov 30, 2006
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package integral heat spreader
- Publication number 20060170094
- Publication date Aug 3, 2006
- Intel Corporation
- Sankara J. Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of providing a heat spreader
- Publication number 20060127672
- Publication date Jun 15, 2006
- Gregory M. Chrysler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic assembly including a die having an integrated circuit an...
- Publication number 20050130362
- Publication date Jun 16, 2005
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly including a die having an integrated circuit an...
- Publication number 20040157386
- Publication date Aug 12, 2004
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with high capacity thermal interface and method...
- Publication number 20040082188
- Publication date Apr 29, 2004
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond integrated heat spreader and method of manufacturing same
- Publication number 20030152773
- Publication date Aug 14, 2003
- Gregory M. Chrysler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic assembly including a die having an integrated circuit an...
- Publication number 20030025198
- Publication date Feb 6, 2003
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Publication number 20020080583
- Publication date Jun 27, 2002
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Publication number 20020080584
- Publication date Jun 27, 2002
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with high capacity thermal interface and method...
- Publication number 20020074649
- Publication date Jun 20, 2002
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS

Abhay W. Watwe

Person

Patents Grantslast 30 patents

Electronic assembly including a die having an integrated circuit an...

Electronic assembly including a die having an integrated circuit an...

Electronic assembly with high capacity thermal interface and method...

Electronic assembly including a die having an integrated circuit an...

Electronic assembly including a die having an integrated circuit an...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Electronic assembly with high capacity thermal interface

Integrated vapor chamber heat sink and spreader and an embedded dir...

Thermal cooling apparatus

Heat sink with a heat pipe for spreading of heat

Patents Applicationslast 30 patents

Electronic assembly including a die having an integrated circuit an...

Semiconductor package integral heat spreader

Method of providing a heat spreader

Electronic assembly including a die having an integrated circuit an...

Electronic assembly including a die having an integrated circuit an...

Electronic assembly with high capacity thermal interface and method...

Diamond integrated heat spreader and method of manufacturing same

Electronic assembly including a die having an integrated circuit an...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Electronic assembly with high capacity thermal interface and method...