Abhishek Gupta

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,409,929
- Issue date Apr 2, 2013
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating robust integrated heat spreader designs and...
- Patent number 8,174,113
- Issue date May 8, 2012
- Intel Corporation
- Abhishek Gupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,030,757
- Issue date Oct 4, 2011
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Forming A Semiconductor Package Including A Thermal Interface Material
- Publication number 20110312131
- Publication date Dec 22, 2011
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating robust integrated heat spreader designs and...
- Publication number 20100065246
- Publication date Mar 18, 2010
- Abhishek Gupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming a semiconductor package including a thermal interface material
- Publication number 20090001557
- Publication date Jan 1, 2009
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package and method of manufacturing same
- Publication number 20080277779
- Publication date Nov 13, 2008
- Abhishek Gupta
- H01 - BASIC ELECTRIC ELEMENTS