Abi Awujoola

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Union City, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package substrate with high density routing mech...
- Patent number 6,891,260
- Issue date May 10, 2005
- LSI Logic Corporation
- Leonard L. Mora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate with multiple voltage supplies
- Patent number 6,777,802
- Issue date Aug 17, 2004
- LSI Logic Corporation
- Leonard L. Mora
- H01 - BASIC ELECTRIC ELEMENTS