Membership
Tour
Register
Log in
Abu K. Eghan
Follow
Person
San Jose, CA, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit and method of implementing a contact pad in an i...
Patent number
7,701,070
Issue date
Apr 20, 2010
Xilinx, Inc.
Richard C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die with high density offset-inline bond arrangement
Patent number
7,064,450
Issue date
Jun 20, 2006
Xilinx, Inc.
Abu K. Eghan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance flipchip package that incorporates heat removal wi...
Patent number
7,061,102
Issue date
Jun 13, 2006
Xilinx, Inc.
Abu K. Eghan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
High performance flipchip package that incorporates heat removal wi...
Publication number
20020185717
Publication date
Dec 12, 2002
Xilinx, Inc.
Abu K. Eghan
H01 - BASIC ELECTRIC ELEMENTS