TREA

Achim Froemelt

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  • Warstein, DE
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module bonding wire connection method
    • Patent number 9,925,588
    • Issue date Mar 27, 2018
    • Infineon Technologies AG
    • Daniel Bolowski
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering method
    • Patent number 8,941,035
    • Issue date Jan 27, 2015
    • Infineon Technologies AG
    • Guido Strotmann
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
    • Publication number 20150333034
    • Publication date Nov 19, 2015
    • INFINEON TECHNOLOGIES AG
    • Daniel Bolowski
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Soldering Method
    • Publication number 20120248094
    • Publication date Oct 4, 2012
    • INFINEON TECHNOLOGIES AG
    • Guido Strotmann
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR