Achim Trautmann

Person

Leonberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a substrate, substrate, metal-oxide-semiconduc...
- Patent number 10,636,901
- Issue date Apr 28, 2020
- Robert Bosch GmbH
- Achim Trautmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS field-effect transistor and method for the production thereof
- Patent number 10,608,105
- Issue date Mar 31, 2020
- Robert Bosch GmbH
- Michael Grieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle sensor and method for manufacturing a particle sensor
- Patent number 10,126,224
- Issue date Nov 13, 2018
- Robert Bosch GmbH
- Achim Trautmann
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a dielectric field plate in a substrate trench...
- Patent number 9,972,690
- Issue date May 15, 2018
- Robert Bosch GmbH
- Achim Trautmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one contact, and manufacturing...
- Patent number 9,202,702
- Issue date Dec 1, 2015
- Robert Bosch GmbH
- Frederik Schrey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoresistive micromechanical sensor component and corresponding m...
- Patent number 9,110,090
- Issue date Aug 18, 2015
- Robert Bosch GmbH
- Reinhard Neul
- G01 - MEASURING TESTING
Information Patent Grant
Arrangement of two substrates having an SLID bond and method for pr...
- Patent number 9,111,787
- Issue date Aug 18, 2015
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component having a silicon carbide coated via
- Patent number 8,405,190
- Issue date Mar 26, 2013
- Robert Bosch GmbH
- Achim Trautmann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing a Dielectric Field Plate in a Substrate Trench...
- Publication number 20170117369
- Publication date Apr 27, 2017
- ROBERT BOSCH GmbH
- Achim Trautmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Substrate, Substrate, Metal-Oxide-Semiconduc...
- Publication number 20160218208
- Publication date Jul 28, 2016
- ROBERT BOSCH GmbH
- Achim Trautmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE SENSOR AND METHOD FOR MANUFACTURING A PARTICLE SENSOR
- Publication number 20160195464
- Publication date Jul 7, 2016
- ROBERT BOSCH GmbH
- Achim Trautmann
- G01 - MEASURING TESTING
Information Patent Application
MOS FIELD-EFFECT TRANSISTOR AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20160118494
- Publication date Apr 28, 2016
- ROBERT BOSCH GmbH
- Michael GRIEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL STRUCTURE AND CORESPONDING MANUFACTURING METHOD
- Publication number 20140355094
- Publication date Dec 4, 2014
- ROBERT BOSCH GmbH
- Nicolas SCHORR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Piezoresistive Micromechanical Sensor Component and Corresponding M...
- Publication number 20130098154
- Publication date Apr 25, 2013
- ROBERT BOSCH GmbH
- Reinhard Neul
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AT LEAST ONE CONTACT, AND MANUFACTURING...
- Publication number 20120292641
- Publication date Nov 22, 2012
- Frederik Schrey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Contact Arrangement For Establishing A Spaced, Electrically Conduct...
- Publication number 20120187509
- Publication date Jul 26, 2012
- ROBERT BOSCH GmbH
- Knut Gottfried
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT HAVING A VIA, AND A METHOD FOR MANUFACTURING SUCH A COMPO...
- Publication number 20120038049
- Publication date Feb 16, 2012
- Achim Trautmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement of Two Substrates having an SLID Bond and Method for Pr...
- Publication number 20110233750
- Publication date Sep 29, 2011
- ROBERT BOSCH GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...
- Publication number 20100308475
- Publication date Dec 9, 2010
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Achim Trautmann

Person

Patents Grantslast 30 patents

Method for producing a substrate, substrate, metal-oxide-semiconduc...

MOS field-effect transistor and method for the production thereof

Particle sensor and method for manufacturing a particle sensor

Method for producing a dielectric field plate in a substrate trench...

Semiconductor device having at least one contact, and manufacturing...

Piezoresistive micromechanical sensor component and corresponding m...

Arrangement of two substrates having an SLID bond and method for pr...

Micromechanical method and corresponding assembly for bonding semic...

Component having a silicon carbide coated via

Patents Applicationslast 30 patents

Method for Producing a Dielectric Field Plate in a Substrate Trench...

Method for Producing a Substrate, Substrate, Metal-Oxide-Semiconduc...

PARTICLE SENSOR AND METHOD FOR MANUFACTURING A PARTICLE SENSOR

MOS FIELD-EFFECT TRANSISTOR AND METHOD FOR THE PRODUCTION THEREOF

MICROMECHANICAL STRUCTURE AND CORESPONDING MANUFACTURING METHOD

Piezoresistive Micromechanical Sensor Component and Corresponding M...

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE CONTACT, AND MANUFACTURING...

Micromechanical Method and Corresponding Assembly for Bonding Semic...

Contact Arrangement For Establishing A Spaced, Electrically Conduct...

COMPONENT HAVING A VIA, AND A METHOD FOR MANUFACTURING SUCH A COMPO...

Arrangement of Two Substrates having an SLID Bond and Method for Pr...

COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...