ADAM C. SMITH

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ESSEX JUNCTION, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
IC wafer for identification of circuit dies after dicing
- Patent number 10,700,013
- Issue date Jun 30, 2020
- GLOBALFOUNDRIES Inc.
- Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual exposure patterning of a photomask to print a contact, a via o...
- Patent number 9,927,698
- Issue date Mar 27, 2018
- GLOBALFOUNDRIES Inc.
- Jed H. Rankin
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
IC WAFER FOR IDENTIFICATION OF CIRCUIT DIES AFTER DICING
- Publication number 20190214348
- Publication date Jul 11, 2019
- GLOBALFOUNDRIES INC.
- Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL EXPOSURE PATTERNING OF A PHOTOMASK TO PRINT A CONTACT, A VIA O...
- Publication number 20180046073
- Publication date Feb 15, 2018
- GLOBALFOUNDRIES INC.
- JED H. RANKIN
- H01 - BASIC ELECTRIC ELEMENTS