Adam Gildea

Person

Albany, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
MULTI-MATERIAL CHUCK
- Publication number 20250112083
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS
- Publication number 20250096190
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Adam GILDEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDABLE WAFER BONDER
- Publication number 20250087521
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS
- Publication number 20240234363
- Publication date Jul 11, 2024
- TOKYO ELECTRON LIMITED
- Scott LEFEVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS
- Publication number 20240170444
- Publication date May 23, 2024
- TOKYO ELECTRON LIMITED
- Scott LEFEVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
- Publication number 20240071984
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS

Adam Gildea

Person

Patents Applicationslast 30 patents

MULTI-MATERIAL CHUCK

METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS

EXPANDABLE WAFER BONDER

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

BONDING LAYER AND PROCESS

BONDING LAYER AND PROCESS

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT