Adam Jandl

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Pleasanton, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 11,355,345
- Issue date Jun 7, 2022
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain-balanced semiconductor structure
- Patent number 11,005,231
- Issue date May 11, 2021
- IQE pic
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 10,573,522
- Issue date Feb 25, 2020
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20220262640
- Publication date Aug 18, 2022
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIN-BALANCED SEMICONDUCTOR STRUCTURE
- Publication number 20210257809
- Publication date Aug 19, 2021
- IQE plc
- Andrew CLARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20200144066
- Publication date May 7, 2020
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20180053660
- Publication date Feb 22, 2018
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS