Adam M. Kennedy

Person

Santa Barbara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mosaic focal plane array
- Patent number 12,261,186
- Issue date Mar 25, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imager with integrated asynchronous laser pulse detection having a...
- Patent number 11,750,945
- Issue date Sep 5, 2023
- Raytheon Company
- Adam M. Kennedy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Digital pixel having high sensitivity and dynamic range
- Patent number 11,284,025
- Issue date Mar 22, 2022
- Raytheon Company
- Neil R. Malone
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Per-pixel dark reference bolometer
- Patent number 10,451,487
- Issue date Oct 22, 2019
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 10,315,918
- Issue date Jun 11, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared scene projector with per-pixel spectral and polarisation c...
- Patent number 10,267,997
- Issue date Apr 23, 2019
- Raytheon Company
- Justin Gordon Adams Wehner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 10,262,913
- Issue date Apr 16, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,969,610
- Issue date May 15, 2018
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,966,320
- Issue date May 8, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of an external getter to reduce package pressure
- Patent number 9,865,519
- Issue date Jan 9, 2018
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,771,258
- Issue date Sep 26, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,708,181
- Issue date Jul 18, 2017
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of an external getter to reduce package pressure
- Patent number 9,570,321
- Issue date Feb 14, 2017
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,520,332
- Issue date Dec 13, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 9,427,776
- Issue date Aug 30, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,334,154
- Issue date May 10, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaged infrared (IR) focal plane array (FPA) with eva...
- Patent number 9,227,839
- Issue date Jan 5, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter structure and method for forming such structure
- Patent number 9,196,556
- Issue date Nov 24, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming deposited patterns on a surface
- Patent number 9,105,800
- Issue date Aug 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,093,444
- Issue date Jul 28, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for 3D UV imaging
- Patent number 9,091,748
- Issue date Jul 28, 2015
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Optical device for detection of an agent
- Patent number 8,928,883
- Issue date Jan 6, 2015
- Raytheon Company
- Frank B. Jaworski
- G01 - MEASURING TESTING
Information Patent Grant
Multichip packaging for imaging system
- Patent number 8,653,467
- Issue date Feb 18, 2014
- Raytheon Company
- Stephen H. Black
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for detecting neutron radiation
- Patent number 8,389,947
- Issue date Mar 5, 2013
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Variable aperture optical device having a microshutter
- Patent number 8,218,220
- Issue date Jul 10, 2012
- Raytheon Company
- Robert K. Dodds
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermally stabilized radiation detector utilizing temperature contr...
- Patent number 7,105,821
- Issue date Sep 12, 2006
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Integrated package design and method for a radiation sensing device
- Patent number 7,084,010
- Issue date Aug 1, 2006
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus providing focal plane array active thermal con...
- Patent number 6,649,913
- Issue date Nov 18, 2003
- Raytheon Company
- Adam M. Kennedy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MOSAIC FOCAL PLANE ARRAY
- Publication number 20250151444
- Publication date May 8, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSAIC FOCAL PLANE ARRAY
- Publication number 20220310690
- Publication date Sep 29, 2022
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL PIXEL HAVING HIGH SENSITIVITY AND DYNAMIC RANGE
- Publication number 20210377470
- Publication date Dec 2, 2021
- Raytheon Company
- Neil R. Malone
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGER WITH INTEGRATED ASYNCHORONOUS LASER PULSE DETECTION
- Publication number 20210227158
- Publication date Jul 22, 2021
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20180226309
- Publication date Aug 9, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
USE OF AN EXTERNAL GETTER TO REDUCE PACKAGE PRESSURE
- Publication number 20170148695
- Publication date May 25, 2017
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20170129775
- Publication date May 11, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED SCENE PROJECTOR WITH PER-PIXEL SPECTRAL AND POLARISATION C...
- Publication number 20170131475
- Publication date May 11, 2017
- Raytheon Company
- Justin Gordon Adams Wehner
- G02 - OPTICS
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20170011977
- Publication date Jan 12, 2017
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20160376146
- Publication date Dec 29, 2016
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20160340179
- Publication date Nov 24, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
- Publication number 20160167959
- Publication date Jun 16, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20160040282
- Publication date Feb 11, 2016
- Raytheon Company
- Roland Gooch
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
- Publication number 20160039665
- Publication date Feb 11, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...
- Publication number 20150321905
- Publication date Nov 12, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150279755
- Publication date Oct 1, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20150249042
- Publication date Sep 3, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE
- Publication number 20150162479
- Publication date Jun 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150014854
- Publication date Jan 15, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE
- Publication number 20140175590
- Publication date Jun 26, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20140053966
- Publication date Feb 27, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIXEL STRUCTURE WITH REDUCED VACUUM REQUIREMENTS
- Publication number 20130334635
- Publication date Dec 19, 2013
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Application
Multichip Packaging for Imaging System
- Publication number 20130334425
- Publication date Dec 19, 2013
- Raytheon Company
- Stephen H. Black
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR 3D UV IMAGING
- Publication number 20130278716
- Publication date Oct 24, 2013
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Application
Method and System for Detecting Neutron Radiation
- Publication number 20120326047
- Publication date Dec 27, 2012
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Application
USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATI...
- Publication number 20120281113
- Publication date Nov 8, 2012
- Raytheon Company
- Adam M. Kennedy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VARIABLE APERTURE OPTICAL DEVICE HAVING A MICROSHUTTER
- Publication number 20120169884
- Publication date Jul 5, 2012
- Raytheon Company
- Robert K. Dodds
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Adam M. Kennedy

Person

Patents Grantslast 30 patents

Mosaic focal plane array

Imager with integrated asynchronous laser pulse detection having a...

Digital pixel having high sensitivity and dynamic range

Per-pixel dark reference bolometer

Method of stress relief in anti-reflective coated cap wafers for wa...

Infrared scene projector with per-pixel spectral and polarisation c...

Wafer level package solder barrier used as vacuum getter

Wafer level MEMS package including dual seal ring

Wafer level package solder barrier used as vacuum getter

Use of an external getter to reduce package pressure

Wafer level MEMS package including dual seal ring

Hermetically sealed package having stress reducing layer

Use of an external getter to reduce package pressure

Wafer level package solder barrier used as vacuum getter

Method of stress relief in anti-reflective coated cap wafers for wa...

Hermetically sealed package having stress reducing layer

Wafer level packaged infrared (IR) focal plane array (FPA) with eva...

Getter structure and method for forming such structure

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Method of forming deposited patterns on a surface

Wafer level package solder barrier used as vacuum getter

Methods and apparatus for 3D UV imaging

Optical device for detection of an agent

Multichip packaging for imaging system

Method and system for detecting neutron radiation

Variable aperture optical device having a microshutter

Thermally stabilized radiation detector utilizing temperature contr...

Integrated package design and method for a radiation sensing device

Method and apparatus providing focal plane array active thermal con...

Patents Applicationslast 30 patents

MOSAIC FOCAL PLANE ARRAY

MOSAIC FOCAL PLANE ARRAY

DIGITAL PIXEL HAVING HIGH SENSITIVITY AND DYNAMIC RANGE

IMAGER WITH INTEGRATED ASYNCHORONOUS LASER PULSE DETECTION

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

USE OF AN EXTERNAL GETTER TO REDUCE PACKAGE PRESSURE

WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING

INFRARED SCENE PROJECTOR WITH PER-PIXEL SPECTRAL AND POLARISATION C...

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

PIXEL STRUCTURE WITH REDUCED VACUUM REQUIREMENTS

Multichip Packaging for Imaging System

METHODS AND APPARATUS FOR 3D UV IMAGING

Method and System for Detecting Neutron Radiation

USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATI...

VARIABLE APERTURE OPTICAL DEVICE HAVING A MICROSHUTTER