Adam M. Wolski

Person

Edgewater Park, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper foil and copper clad laminates for fabrication of multi-laye...
- Patent number 6,372,113
- Issue date Apr 16, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Simplified process for production of roughened copper foil
- Patent number 6,270,645
- Issue date Aug 7, 2001
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process and apparatus for the manufacture of high peel-strength cop...
- Patent number 6,270,648
- Issue date Aug 7, 2001
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for electrodeposition of barrier layer over copper foil bon...
- Patent number 6,224,991
- Issue date May 1, 2001
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper foil having a modified shiny side
- Patent number 5,989,727
- Issue date Nov 23, 1999
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for the manufacture of high quality very low profile copper...
- Patent number 5,863,410
- Issue date Jan 26, 1999
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil for fine pattern and method for produc...
- Patent number 5,834,140
- Issue date Nov 10, 1998
- Circuit Foil Japan Co., Ltd.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for the manufacture of printed circuit boards and metho...
- Patent number 5,447,619
- Issue date Sep 5, 1995
- Circuit Foil USA, Inc.
- Adam M. Wolski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile copper foil and process and apparatus for making bondab...
- Patent number 5,215,646
- Issue date Jun 1, 1993
- Circuit Foil USA, Inc.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of producing treated copper foil, products thereof and elect...
- Patent number 5,207,889
- Issue date May 4, 1993
- Circuit Foil USA, Inc.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Continuous process for coating printed circuit grade copper foil wi...
- Patent number 4,915,797
- Issue date Apr 10, 1990
- Yates Industries, Inc.
- Lawrence E. Vigezzi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Treatment for copper foil
- Patent number 4,572,768
- Issue date Feb 25, 1986
- Square D Company
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plural copper-layer treatment of copper foil and article made thereby
- Patent number RE30180
- Issue date Dec 25, 1979
- Yates Industries, Inc.
- Adam M. Wolski
- 428 - Stock material or miscellaneous articles
Information Patent Grant
Thin foil
- Patent number 3,998,601
- Issue date Dec 21, 1976
- Yates Industries, Inc.
- Charles B. Yates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Process and apparatus for the manufacture of high peel-strength cop...
- Publication number 20020023844
- Publication date Feb 28, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL AND COPPER CLAD LAMINATES FOR FABRICATION OF MULTI-LAYE...
- Publication number 20010051282
- Publication date Dec 13, 2001
- Yates Foil USA, Inc.
- CHARLES B. YATES
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Adam M. Wolski

Person

Patents Grantslast 30 patents

Copper foil and copper clad laminates for fabrication of multi-laye...

Simplified process for production of roughened copper foil

Process and apparatus for the manufacture of high peel-strength cop...

Process for electrodeposition of barrier layer over copper foil bon...

Electrolytic copper foil having a modified shiny side

Process for the manufacture of high quality very low profile copper...

Electrodeposited copper foil for fine pattern and method for produc...

Copper foil for the manufacture of printed circuit boards and metho...

Low profile copper foil and process and apparatus for making bondab...

Method of producing treated copper foil, products thereof and elect...

Continuous process for coating printed circuit grade copper foil wi...

Treatment for copper foil

Plural copper-layer treatment of copper foil and article made thereby

Thin foil

Patents Applicationslast 30 patents

Process and apparatus for the manufacture of high peel-strength cop...

COPPER FOIL AND COPPER CLAD LAMINATES FOR FABRICATION OF MULTI-LAYE...