Adam Shepela

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Bolton, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming electrical interconnects having electromigration-...
- Patent number 7,062,850
- Issue date Jun 20, 2006
- Hewlett-Packard Development Company, L.P.
- Eugenia Atakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrical interconnects having electromigration-...
- Patent number 6,904,675
- Issue date Jun 14, 2005
- Hewlett-Packard Development, L.P.
- Eugenia Atakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrical interconnects having electromigration-...
- Patent number 6,678,951
- Issue date Jan 20, 2004
- Hewlett-Packard Development Company, L.P.
- Eugenia Atakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure having electromigration-inhibitin...
- Patent number 6,245,996
- Issue date Jun 12, 2001
- Compaq Computer Corporation
- Eugenia Atakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor fabrication process in which a contact metallization is...
- Patent number 6,060,387
- Issue date May 9, 2000
- Compaq Computer Corporation
- Adam Shepela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a metal-semiconductor contact
- Patent number 5,094,980
- Issue date Mar 10, 1992
- Digital Equipment Corporation
- Adam Shepela
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electrical interconnect structure and method of forming electrical...
- Publication number 20040071991
- Publication date Apr 15, 2004
- Eugenia Atakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical interconnect structure and method of forming electrical...
- Publication number 20010001427
- Publication date May 24, 2001
- Eugenia Atakov
- H01 - BASIC ELECTRIC ELEMENTS