Adam Zbrzezny

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Scarborough, CA

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaging of semiconductor chips
- Patent number 8,785,317
- Issue date Jul 22, 2014
- ATI Technologies ULC
- Neil Mclellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of semiconductor chips
- Patent number 8,344,505
- Issue date Jan 1, 2013
- ATI Technologies ULC
- Neil Mclellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die substrate with reinforcement structure
- Patent number 8,313,984
- Issue date Nov 20, 2012
- ATI Technologies ULC
- Roden Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package employing predetermined three-dimensiona...
- Patent number 7,888,259
- Issue date Feb 15, 2011
- ATI Technologies ULC
- Adam R. Zbrzezny
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGING OF SEMICONDUCTOR CHIPS
- Publication number 20130095614
- Publication date Apr 18, 2013
- ATI Technologies ULC
- Neil Mclellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE EMPLOYING PREDETERMINED THREE-DIMENSIONA...
- Publication number 20100044884
- Publication date Feb 25, 2010
- ATI Technologies ULC
- Adam R. Zbrzezny
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Die substrate with reinforcement structure
- Publication number 20090236730
- Publication date Sep 24, 2009
- Roden Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGING OF SEMICONDUCTOR CHIPS
- Publication number 20090057887
- Publication date Mar 5, 2009
- ATI Technologies ULC
- Neil Mclellan
- H01 - BASIC ELECTRIC ELEMENTS