Addi B. Mistry

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable molded packages and methods of making the same
- Patent number 8,044,494
- Issue date Oct 25, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital and RF system and method therefor
- Patent number 7,479,407
- Issue date Jan 20, 2009
- FREESCALE SEMICONDUCTOR, INC.
- John Gehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing a semiconductor structure having t...
- Patent number 7,262,615
- Issue date Aug 28, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Edmond Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with multiple sides having package contacts
- Patent number 6,815,254
- Issue date Nov 9, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing an interconnect structure
- Patent number 6,429,531
- Issue date Aug 6, 2002
- Motorola, Inc.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stress relief in solder bump formation on...
- Patent number 6,077,726
- Issue date Jun 20, 2000
- Motorola, Inc.
- Addi Burjorji Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped semiconductor device having a trench for stress relief
- Patent number 5,943,597
- Issue date Aug 24, 1999
- Motorola, Inc.
- James H. Kleffner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20100013065
- Publication date Jan 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20080108179
- Publication date May 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable molded packages and methods of making the same
- Publication number 20070141751
- Publication date Jun 21, 2007
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for testing a semiconductor structure having t...
- Publication number 20070096760
- Publication date May 3, 2007
- Edmond Cheng
- G01 - MEASURING TESTING
Information Patent Application
Digital and RF system and method therefor
- Publication number 20040195591
- Publication date Oct 7, 2004
- John Gehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with multiple sides having package contacts
- Publication number 20040178499
- Publication date Sep 16, 2004
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS

Addi B. Mistry

Person

Patents Grantslast 30 patents

Stackable molded packages and methods of making the same

Digital and RF system and method therefor

Method and apparatus for testing a semiconductor structure having t...

Semiconductor package with multiple sides having package contacts

Method and apparatus for manufacturing an interconnect structure

Method and apparatus for stress relief in solder bump formation on...

Bumped semiconductor device having a trench for stress relief

Patents Applicationslast 30 patents

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

Stackable molded packages and methods of making the same

Method and apparatus for testing a semiconductor structure having t...

Digital and RF system and method therefor

Semiconductor package with multiple sides having package contacts