Adi Irwan Bin Herman

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Selangor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Solder surface features for integrated circuit packages
- Patent number 12,021,011
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with delamination resistant feature
- Patent number 11,837,532
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER SURFACE FEATURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20230069741
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- AMIRUL AFIQ BIN HUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH DELAMINATION RESISTANT FEATURE
- Publication number 20210217686
- Publication date Jul 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ROLLING
- Publication number 20210217630
- Publication date Jul 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS