Aditya Sundoctor VAIDYA

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded bridge die with through-silicon vias
- Patent number 12,159,813
- Issue date Dec 3, 2024
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon vias
- Patent number 11,587,851
- Issue date Feb 21, 2023
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon Vias
- Patent number 11,049,798
- Issue date Jun 29, 2021
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for warpage thermal and interconnect solutions
- Patent number 10,672,626
- Issue date Jun 2, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon vias
- Patent number 10,373,893
- Issue date Aug 6, 2019
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for warpage thermal and interconnect solutions
- Patent number 9,607,964
- Issue date Mar 28, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20250046680
- Publication date Feb 6, 2025
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20230197574
- Publication date Jun 22, 2023
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20210272881
- Publication date Sep 2, 2021
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20190326198
- Publication date Oct 24, 2019
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20190006264
- Publication date Jan 3, 2019
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE IC PACKAGE STIFFENER
- Publication number 20170287799
- Publication date Oct 5, 2017
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...
- Publication number 20170200621
- Publication date Jul 13, 2017
- Intel Corporation
- Omkar G. KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...
- Publication number 20150279805
- Publication date Oct 1, 2015
- Omkar G. KARHADE
- H01 - BASIC ELECTRIC ELEMENTS

Aditya Sundoctor VAIDYA

Person

Patents Grantslast 30 patents

Embedded bridge die with through-silicon vias

Embedded bridge with through-silicon vias

Embedded bridge with through-silicon Vias

Method and materials for warpage thermal and interconnect solutions

Embedded bridge with through-silicon vias

Method and materials for warpage thermal and interconnect solutions

Patents Applicationslast 30 patents

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

REMOVABLE IC PACKAGE STIFFENER

NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...

NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...